公开(公告)号：DE102012219693A1

公开(公告)日：2013-05-16

申请号：DE102012219693

申请日：2012-10-29

Applicant: IBM

Inventor： BARINA RICHARD M ,  KAMATH VINOD ,  NI CHUNJIAN ,  SCHMIDT DEREK I ,  STEINKE MARK E ,  WOMBLE JAMES S

IPC: G06F1/20 ,  H01L23/473 ,  H05K7/20

Abstract: Ein Kühlsystem für ein Speichermodul weist eine Wärmeleitbaugruppe zum Leiten von Wärme vom Speichermodul zu flüssigkeitsgekühlten Montageblöcken auf. In einer Ausführungsform enthält jede Wärmeleitbaugruppe einen Rahmen mit gegenüberliegenden ersten und zweiten Halterungen, erste und zweite Wärmeverteilerplatten, die sich jeweils von der ersten Halterung zur zweiten Halterung erstrecken, und ein Paar abgeflachter Wärmeleitrohre, die sich jeweils entlang einer entsprechenden der Wärmeverteilerplatten von der ersten Halterung zur zweiten Halterung erstrecken. Die flüssigkeitsgekühlten Montageblöcke halten die Wärmeleitbaugruppe trennbar über einem Speichermodulsockel, wobei sich das Speichermodul zwischen den Wärmeverteilerplatten befindet.

公开(公告)号：GB2496020B

公开(公告)日：2014-07-23

申请号：GB201216684

申请日：2012-09-19

Applicant: IBM

Inventor： SCHMIDT ROGER ,  LYENGAR MADHUSUDAN ,  GRAYBILL DAVID ,  COICO PATRICK ANTHONY ,  KOCHUPARAMBIL JOSE BEJOY ,  CHAINER TIMOTHY JOSEPH ,  STEINKE MARK EDWARD ,  KAMATH VINOD

IPC: H05K7/20

公开(公告)号：GB2496481B

公开(公告)日：2013-09-25

申请号：GB201218540

申请日：2012-10-16

Applicant: IBM

Inventor： STEINKE MARK EDWARD ,  KAMATH VINOD ,  SCHMIDT DEREK IAN ,  WOMBLE JAMES SCOTT ,  NI CHUNJIAN ,  BARINA RICHARD

IPC: H05K7/20 ,  F28F7/02 ,  G06F1/20 ,  H01L23/473

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

公开(公告)号：GB2497638A

公开(公告)日：2013-06-19

申请号：GB201221225

申请日：2012-11-26

Applicant: IBM

Inventor： KAMATH VINOD ,  SCHMIDT DEREK IAN ,  STEINKE MARK EDWARD ,  WOMBLE JAMES SCOTT

IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20

Abstract: A liquid cooled planer 200 such as a printed circuit board including one or more computing components such as computer memory or processors mounted on the planer 200, wherein at least one or more of the computing components are liquid cooled. One or more conductive cooling components 302 are mounted on the planer 200 and one or more convective cooling components 502 are mounted on the planer 200. The conductive cooling components 302 may be a cold plate that transfers heat to a heat sink. The convective cooling components 502 which may be fluid or liquid carrying pipes, tubes or ducts are removable from the planer 200 without removing the conductive cooling components from the planer 200 for example a water carry pipe may be attached to the cold plate through the use of braces, brackets or other physical elements so that detaching the water carry pipe from the cold plate only involves disengaging the pipe from these attachment elements.

公开(公告)号：DE102012221683A1

公开(公告)日：2013-07-04

申请号：DE102012221683

申请日：2012-11-28

Applicant: IBM

Inventor： KAMATH VINOD ,  SCHMIDT DEREK I ,  STEINKE MARK E ,  WOMBLE JAMES S

IPC: G06F1/20 ,  H05K7/20

Abstract: Eine flüssigkeitsgekühlte zentrale Platine, die aufweist: eine oder mehrere Datenverarbeitungskomponenten, die auf der zentralen Platine montiert sind, wobei mindestens eine oder mehrere der Datenverarbeitungskomponenten flüssigkeitsgekühlt ist bzw. sind; eine oder mehrere konduktive Kühlungskomponenten, die auf der zentralen Platine montiert ist bzw. sind; und eine oder mehrere konvektive Kühlungskomponenten, die auf der zentralen Platine montiert ist bzw. sind, wobei die konvektiven Kühlungskomponenten von der zentralen Platine entfernbar sind, ohne dass die konduktiven Kühlungskomponenten von der zentralen Platine entfernt werden.

公开(公告)号：GB2496481A

公开(公告)日：2013-05-15

申请号：GB201218540

申请日：2012-10-16

Applicant: IBM

Inventor： STEINKE MARK EDWARD ,  KAMATH VINOD ,  SCHMIDT DEREK IAN ,  WOMBLE JAMES SCOTT ,  NI CHUNJIAN ,  BARINA RICHARD

IPC: H05K7/20 ,  F28F7/02 ,  G06F1/20 ,  H01L23/473

Abstract: A cooling system for memory modules for example dual in-line memory modules (DIMMs) supporting dual random access memory (DRAM) chips (Fig. 2; 24) on either side of a circuit board (Fig. 2; 22) comprises a heat conduction assembly 10 for each memory module 20 which allows conduction of heat in a direction parallel to a system board 12, from the memory modules to a pair of liquid-cooled mounting blocks 40, 140 located at opposing ends of parallel slot shaped sockets 30 for receiving the modules. Each heat conduction assembly includes a frame having opposing first and second supports 61, 62, first and second heat spreader plates 64, 65 each extending from the first support 61 to the second support 62, and a pair of fluid-filled flattened heat pipes 66 each extending along a respective one of the heat spreader plates. The liquid-cooled mounting blocks 40, 140 releasably support the heat conduction assemblies over the memory module sockets 30 with the memory module between the heat spreader plates so that the memory chips are in thermal engagement with the heat spreader plates 64, 65.

公开(公告)号：GB2496020A

公开(公告)日：2013-05-01

申请号：GB201216684

申请日：2012-09-19

Applicant: IBM

Inventor： SCHMIDT ROGER ,  LYENGAR MADHUSUDAN ,  GRAYBILL DAVID ,  COICO PATRICK ANTHONY ,  KAMATH VINOD ,  STEINKE MARK EDWARD ,  KOCHUPARAMBIL JOSE BEJOY ,  CHAINER TIMOTHY JOSEPH

IPC: H05K7/20

Abstract: A cooling apparatus for an electronics rack includes an air-to-liquid heat exchanger 530, one or more coolant-cooled structures 520 and a tube; the heat exchanger 530, is disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section; the coolant-cooled structure(s) 520 are in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant; the tube connects in fluid communication one coolant-cooled structure 520 and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger 530 and the coolant-cooled structure 520. Also disclosed is a method of fabricating the above cooling apparatus and a cooled electronic system comprising the above cooling apparatus and an electronics rack. The cooling apparatus may also comprise an airflow director 512 configured to redirect airflow exhausting from the electronics rack at the outlet side through an airflow return pathway 531 to the inlet side of the rack, where the heat exchanger 530 may be provided in the airflow return pathway 531.