公开(公告)号：SG92634A1

公开(公告)日：2002-11-19

申请号：SG1999001579

申请日：1999-03-31

Applicant: IBM

Inventor： JIMAREZ MIGUEL A ,  JOHNSON ERIC A ,  LI LI ,  OBRZUT JAN

IPC: H01L21/56 ,  H01L23/498 ,  H01L21/60

Abstract: Flip-chip electronic packages are provided with a compliant surface layer, normally positioned between an underfill layer and a substrate such as a chip carrier or a printed circuit board or card, which reduces stress and strain resulting from differences in coefficients of thermal expansion between the chip and substrate. The compliant layer, which should have a storage modulus of less than ½ the modulus of the substrate, preferably between about 50,000 psi and about 20,000 psi, may comprise rubbery materials such as silicone, virco-plastic polymers such as polytetrafluoroethylene or interpenetrating polymer networks (IPNs). Photosensitive IPNs used for solder marks are preferred.

公开(公告)号：MY138376A

公开(公告)日：2009-05-29

申请号：MYPI9901137

申请日：1999-03-25

Applicant: IBM

Inventor： JIMAREZ MIGUEL A ,  JOHNSON ERIC A ,  LI LI ,  OBRZUT JAN

IPC: H01L21/56 ,  H01L23/498

Abstract: FLIP-CHIP ELECTRONIC PACKAGES ARE PROVIDED WITH A COMPLIANT SURFACE LAYER, NORMALLY POSITIONED BETWEEN AN UNDERFILL LAYER AND A SUBSTRATE SUCH AS A CHIP CARRIER OR A PRINTED CIRCUIT BOARD OR CARD, WHICH REDUCES STRESS AND STRAIN RESULTING FROM DIFFERENCES IN COEFFICIENTS OF THERMAL EXPANSION BETWEEN THE CHIP AND SUBSTRATE. THE COMPLIANT LAYER, WHICH SHOULD HAVE STORAGE MODULUS OF LESS THAN ½ THE MODULUS OF THE SUBSTRATE, PREFERABLY BETWEEN ABOUT 50,000 PSI AND ABOUT 20,000 PSI, MAY COMPRISE RUBBERY MATERIALS SUCH AS SILICONE, VIRCO-PLASTIC POLYMERS SUCH AS POLYTETRAFLUOROETHYLENE OR INTERPENETRATING POLYMER NETWORKS (IPNS). PHOTOSENSITIVE IPNS USED FOR SOLDER MARKS ARE PREFERRED.