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公开(公告)号：CA1165468A
公开(公告)日：1984-04-10
申请号：CA395695
申请日：1982-02-05
Applicant: IBM
Inventor： BHATTACHARYA SOMNATH , HU SHIH-MING , KOOPMAN NICHOLAS G , OLDAKOWSKI CHESTER C
IPC: H01L21/60 , H01L23/485 , H01L23/532 , H05K3/30 , H01L21/88
Abstract: Solder Mound Formation On Substrates A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components. FI9-81-013
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