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    3.
    发明专利
    未知

    公开(公告)号：FR2363891A1

    公开(公告)日：1978-03-31

    申请号：FR7723001

    申请日：1977-07-21

    Applicant: IBM

    Inventor： KOOPMAN NICHOLAS G

    IPC: H01L23/34 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

    Abstract: A method for making a circuit package which exhibits an excellent heat transfer path from a semiconductor chip or other heat generating device to the heat sink can or cover of the package. A heat conducting pad is placed in proximate relationship to either the heat sink or to a surface of the chip and is metallurgically bonded to the other. In one of the preferred embodiments a low melting point solder, such as indium or an alloy thereof, is metallurgically bonded to the inside of the heat sink cover in a limited central region thereof. The solder is then positioned adjacent the chip and reflowed to substantially fill in the gap between the solder and the chip, but with no stress between the chip and the solder. The assembly exhibits excellent heat transfer from the chip to the cover and any associated heat dissipating structures. The preferred method involves the reflow of a mass of solder against the back side of the chip, which has previously been solder-bonded on the front side to conductors on the surface of an alumina substrate.

    4.
    发明专利
    未知

    公开(公告)号：MX145056A

    公开(公告)日：1982-01-04

    申请号：MX17045577

    申请日：1977-09-02

    Applicant: IBM

    Inventor： KOOPMAN NICHOLAS G

    IPC: H01L23/34 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H05K3/34

    Abstract: A method for making a circuit package which exhibits an excellent heat transfer path from a semiconductor chip or other heat generating device to the heat sink can or cover of the package. A heat conducting pad is placed in proximate relationship to either the heat sink or to a surface of the chip and is metallurgically bonded to the other. In one of the preferred embodiments a low melting point solder, such as indium or an alloy thereof, is metallurgically bonded to the inside of the heat sink cover in a limited central region thereof. The solder is then positioned adjacent the chip and reflowed to substantially fill in the gap between the solder and the chip, but with no stress between the chip and the solder. The assembly exhibits excellent heat transfer from the chip to the cover and any associated heat dissipating structures. The preferred method involves the reflow of a mass of solder against the back side of the chip, which has previously been solder-bonded on the front side to conductors on the surface of an alumina substrate.

    CONDUCTION-COOLED CIRCUIT PACKAGE AND METHOD FOR MAKING SAME
    7.
    发明专利
    CONDUCTION-COOLED CIRCUIT PACKAGE AND METHOD FOR MAKING SAME 未知

    公开(公告)号：CA1093699A

    公开(公告)日：1981-01-13

    申请号：CA285781

    申请日：1977-08-30

    Applicant: IBM

    Inventor： KOOPMAN NICHOLAS G ,  TOTTA PAUL A

    IPC: H01L23/34 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433 ,  H05K1/04 ,  H05K3/10

    Abstract: A circuit package exhibiting an excellent heat transfer path from a semiconductor chip or other heat-generating device to the heat-sink can or cover of the package. A heat-conducting pad is metallurgically bonded to either said cover or a surface of said device; the pad is also separably attached, but metallurgically unbonded, to the other. In one preferred embodiment, a readily deformable metal or alloy, such as indium, is metallurgically bonded to a limited central region of the heat sink cover. The deformable metal is separably attached to a major surface of the chip so that there is no stress between the chip or its joints and the solder during the electrical operation of the chip when it generates heat. The preferred method of fabrication involves the mechanical deformation of a mass of solder against the back side of the chip, after the solder has been metallurgically bonded to heat sink. The process may be accomplished either at high or low temperatures, depending upon the solder composition and the relative strength of the leads which join the chip to conductive lands on its supportive substrate.

    METHOD FOR MAKING CONDUCTION-COOLED CIRCUIT PACKAGE
    10.
    发明专利
    METHOD FOR MAKING CONDUCTION-COOLED CIRCUIT PACKAGE 未知

    公开(公告)号：CA1083261A

    公开(公告)日：1980-08-05

    申请号：CA285782

    申请日：1977-08-30

    Applicant: IBM

    Inventor： KOOPMAN NICHOLAS G

    IPC: H01L23/34 ,  H01L23/373 ,  H01L23/40 ,  H01L23/433

    Abstract: METHOD FOR MAKING CONDUCTION-COOLED CIRCUIT PACKAGE A method for making a circuit package which exhibits an excellent heat transfer path from a semiconductor chip or other heat generating device to the heat sink can or cover of the package. A heat conducting pad is placed in proximate relationship to either the heat sink or to a surface of the chip and is metallurgically bonded to the other. In one of the preferred embodiments a low melting point solder, such as indium or an alloy thereof, is metallurgically bonded to the inside of the heat sink cover in a limited central region thereof. The solder is then positioned adjacent the chip and reflowed to substantially fill in the gap between the solder and the chip, but with no stress between the chip and the solder. The assembly exhibits excellent heat transfer from the chip to the cover and any associated heat dissipating structures. The preferred method involves the reflow of a mass of solder against the back side of the chip, which has previously been solderbonded on the front side to conductors on the surface of an alumina substrate.

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