公开(公告)号：US3716464A

公开(公告)日：1973-02-13

申请号：US3716464D

申请日：1969-12-30

Applicant: IBM

Inventor： KOVAC Z ,  OLSEN J

IPC: C25D3/56 ,  C25D5/18 ,  C25D15/02 ,  C25D21/12 ,  C23B5/32

CPC classification number: C25D3/562 ,  C25D5/18 ,  C25D15/02 ,  C25D21/12 ,  Y10S204/09

Abstract: The effect of superimposing a sinusoidal alternating current on a direct current during electrodeposition of Ni-Fe alloys is disclosed in terms of the following factors: (a) maintaining the pH at the electrode equal to that of the bulk electrolyte; (b) ionic diffusion processes; and (c) chemical processes in solution prior to electrochemical reduction. The effect of frequency, amplitude and the rate of a-c current to d-c current on the composition of electrodeposited alloy are given for acid solutions of different pH and for alkaline solutions of metallic complexes with a variable concentration of complexing agent. It is shown that by proper choice of conditions, electrodeposited Fe-Ni alloys can be prepared with a desired uniform composition throughout their thickness. In the practice of this disclosure, alternating current is superimposed on direct current to prevent the pH in the layer of solution adjacent to the electrode from increasing and thus influence the electrodeposition of iron group metals or alloys of any metals which readily form hydroxide. Formation of hydroxides is thus prevented and their inclusion into deposited film is precluded. Additionally, the a-c current beneficially affects the rate of deposition of a metal which is controlled by diffusion. There is no concentration gradient of composition across the thickness of a film of Ni-Fe deposited by practice of this disclosure. Illustratively, Ni and Fe plate out at the same rate for thickness of film approximately in the range of 300A. to 4,000A. By control of the density of the d-c current, and the amplitude and frequency of the a-c current, Ni-Fe film of any given composition approximately in the range of 6 to 60 percent Fe is electroplated from the same solution.

Abstract translation: 根据以下因素公开了在Ni-Fe合金的电沉积期间叠加正弦交流电流对直流电的影响：（a）保持电极上的pH等于体电解质的pH; （b）离子扩散过程; 和（c）在电化学还原之前的溶液中的化学过程。 给出了电沉积合金组成的频率，幅度和a-c电流对d-c电流的影响对不同pH的酸溶液和具有不同浓度络合剂的金属络合物的碱溶液的影响。 显示出通过适当选择条件，可以在其厚度上制备具有所需均匀组成的电沉积Fe-Ni合金。

公开(公告)号：US3798136A

公开(公告)日：1974-03-19

申请号：US3798136D

申请日：1972-06-09

Applicant: IBM

Inventor： OLSEN J ,  ROMANKIW L

IPC: H05K3/40 ,  C25D5/00 ,  C25D5/16 ,  C25D7/00 ,  C25D7/04 ,  H05K1/03 ,  H05K3/42 ,  C23B5/48 ,  C23B5/56

CPC classification number: H05K3/423 ,  C25D7/04 ,  H05K1/0306 ,  H05K2203/1518

Abstract: A METHOD AND APPARATUS FOR PLATING THROUGH LARGE LENGTH TO DIAMETER RATIO HOLES IN A SUBSTRATE IS DISCLOSED. THE METHOD CONSISTS OF FORMING HOLES IN A SUBSTRATE WHICH ARE TAPERED EITHER BY ELECTRON BEAM, OR LASER DRILLING, OR BY FORCING AN APPROPRIATE ETCHANT THROUGH A PREVIOUSLY DRILLED HOLE. THE SUBSTRATE MAY BE OF ANY MATERIAL AND CAN BE EITHER INSULATING OR CONDUCTIVE. IN THE INSTANCE OF THE FORMER, THE SUBSTRATE SHOULD BE OF SUCH A CHARACTER THAT IT IS AMENDABLE TO ELECTROLESS PLATING OR OTHER SURFACE METALLIZING TECHNIQUES. AFTER METALLIZING THE TAPERED HOLE WHERE THE SUBSTRATE IS CONDUCTIVE. THE INTERIORS OF THE TAPERED HOLES ARE ELECTROPLATED WHILE SIMULTANEOUSLY SUBJECTING THE TAPERED PORTION TO AGITATION BY FORCED CONVECTION. USING A PRIOR ART PLATING SOLUTION OF HIGH THROWING POWER, AND FORCING IT THROUGH THE TAPERED HOLES FROM THE LARGE END TOWARD THE SMALL END, CAUSING RELATIVELY HIGH DEPOSITION RATES AT THE WIDEST PORTION OF THE TAPER WHICH GRADUALLY DECREASE ALONG THE LENGTH OF THE TAPER UNTIL THE NARROW PORTION IS REACHED WHERE THE MINIMUM DEPOSITION RATE OCCURS. UNDER SUCH CIRCUMSTANCES, PLATING OCCURS NON-UNIFORMLY ALONG THE LENGTH OF THE TAPER SUCH THAT THE TAPERED HOLES ARE SUBSTANTIALLY CLOSED WITHOUT LEAVING LARGE, UNWANTED VOIDS WHICH CONTRIBUTE TO POOR CONDUCTIVITY, CHARACTERISTICS. THE LENGTH OF HOLES WHICH MAY BE FILLED CAN BE DOUBLED BY PROVIDING A TAPER WHICH DECREASES TOWARD THE MIDPOINT OF A SUBSTRATE AND FROM THERE INCREASES IN SIZE UNTIL THE OPPOSITE SIDE OF THE SUBSTRATE IS REACHED. USING THE SAME ELECTROPLATING SOLUTION OF HIGH THROWING POWER, PLATING THRUGH HOLES OF THIS CHARACTER CAN BE ACCOMPLISHED WHILE PERIODICALLY REVERSING THE DIRECTION OF FLOW TRUGH THE "DOUBLE TAPER" HOLES. APPARATUS FOR CARRYING OUT THE ABOVE DESCRIBED METHOD CONSISTS OF AN ENCLOSED CHAMBER HAVING INLET AND OUTLET PORTS THRUGH WHICH PLATING SOLUTION UNDER PRESSURE CAN BE FORCED. ANODES CONSISTING OF WIRE MESH ARE DISPOSED ADJACENT TO BOTH THE INLET AND OUTLET PORTS WHILE AN ELEMENT CONTAINING HOLES WHICH ARE TO BE PLATED-THROUGH FORMS THE CATHODE AND IS DISPOSED INTERMEDIATE THE ANODES. WHERE A SINGLE TAPER US USED, ELECTROPLATING SOLUTION IS FORCED IN ONE DIRECTION BUT, WHERE A "DOUBLE TAPER" IS UTILIZED, THE FLOW OF ELECTROPLATING SOLUTION IS PERIODICALLY REVERSED. THE METHOD AND APPARATUS OF THE PRESENT INVENTION PROVIDES COMPLETELY PLATED THRUGH-HOLES WHICH HAVE A LENGTH TO DIAMETER IN EXCESS OF 25 AND, IN ADDITION, HAVE EXTREMELY GOOD CONDUCTIVITY CHARACTERISTICS.

公开(公告)号：SE347294B

公开(公告)日：1972-07-31

申请号：SE41068

申请日：1968-01-12

Applicant: IBM

Inventor： KOVAC Z ,  OLSEN J

IPC: C08J7/12 ,  C08L61/10 ,  C23C18/20 ,  C25D5/56

Abstract: 1,176,124. Coating with metals. INTERNATIONAL BUSINESS MACHINES CORP. Jan.8, 1968 [Jan.13, 1967], No.1038/68. Heading C7F. In the electroless deposition of a metal coating on a polymer, the surface is coated with a constituent monomer of the polymer, the monomer polymerized, and coated with a reducible metal salt, the monomer acting as a reducing agent for the metal salt. In an example a urea formaldehyde substrate is soaked in nitric acid, rinsed, dipped in formaldehyde, dried to polymerize the coating, and then the coatings is depolymerized in the presence of a metal salt which may be palladium, gold or nickel chloride or nickel, cobalt. or copper sulphate. The metal salt is reduced during this process. The substrate is then coated with Ni, Co, Cu, Pd or Ni-Fe, Ni-Co, or Ni-W-P alloys. Examples of both alkali and acid electroless nickel plating baths are desinked. The coating may be subsequently electro-plated.