公开(公告)号：JP2003109692A

公开(公告)日：2003-04-11

申请号：JP2001296072

申请日：2001-09-27

Applicant: IBM

Inventor： UENO MAMORU ,  NAKAMURA SHINJI ,  OTSUBO KEIICHI ,  HANGAI TSUTOMU

IPC: H01R43/02 ,  H01R12/04 ,  H01R12/20

Abstract: PROBLEM TO BE SOLVED: To shorten required time and to reduce required cost in manufacturing a printed circuit board and connector assembly by soldering a straddling card edge connector to a printed circuit board. SOLUTION: Terminals 204a, 204b soldered to a first main face 104 are formed of a short one and a long one, and pressure connected to pads 112a, 112b in the different positions in a parallel direction with the first and second main faces and vertical to an edge 108 after mounting a connector 200 to the printed circuit board 100. By the time the solder 302 is hardened, the connector is thereby fixed firmly to the printed circuit board to resist rotational moment around the axis in a parallel direction to the edge and to save time required to attach and detach another tool for fixing.

公开(公告)号：JP2002026468A

公开(公告)日：2002-01-25

申请号：JP2000199768

申请日：2000-06-30

Applicant: IBM

Inventor： TANIMURA HIROTOSHI ,  OTSUBO KEIICHI ,  UENO SHINJI

IPC: H05K7/20 ,  H01L23/36 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04

Abstract: PROBLEM TO BE SOLVED: To approximately uniformly bond a heat dissipating surface of a heat generating component to a heat transfer surface of a printed wiring board to obtain efficient heat dissipation and approximately closely bond the heat dissipating surface of a heat generating electronic component to the heat transfer surface of the printed wiring board to avoid leaving voids. SOLUTION: The printed wiring board 10 for mounting electronic components 26 comprises a heat transfer surface 12 for conducting heat of the electronic components 26 and solder regions 14 formed by sectioning the heat transfer surface 12 into a plurality of independent regions and depositing solder respectively to the plurality of regions, thus forming the board 10.