公开(公告)号：JP2002026468A

公开(公告)日：2002-01-25

申请号：JP2000199768

申请日：2000-06-30

Applicant: IBM

Inventor： TANIMURA HIROTOSHI ,  OTSUBO KEIICHI ,  UENO SHINJI

IPC: H05K7/20 ,  H01L23/36 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H05K13/04

Abstract: PROBLEM TO BE SOLVED: To approximately uniformly bond a heat dissipating surface of a heat generating component to a heat transfer surface of a printed wiring board to obtain efficient heat dissipation and approximately closely bond the heat dissipating surface of a heat generating electronic component to the heat transfer surface of the printed wiring board to avoid leaving voids. SOLUTION: The printed wiring board 10 for mounting electronic components 26 comprises a heat transfer surface 12 for conducting heat of the electronic components 26 and solder regions 14 formed by sectioning the heat transfer surface 12 into a plurality of independent regions and depositing solder respectively to the plurality of regions, thus forming the board 10.