公开(公告)号：GB2287364A

公开(公告)日：1995-09-13

申请号：GB9502159

申请日：1995-02-03

Applicant: IBM

Inventor： DRANCHAK DAVID WILLIAM ,  KELLEHER ROBERT JOSEPH ,  PAGNANI DAVID PETER ,  ZIPPETELLI PATRICK ROBERT

IPC: H01R12/70 ,  H01R12/71 ,  H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H01R9/09

Abstract: An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board 40) includes a pair of substrates 20, 30. The substrate 20 includes opposing circuit patterns 23, 25 that on one surface 22 being of higher density and thus adapted for having high density electronic devices mounted thereon that the pattern on the other surface 24. This high density pattern is electrically coupled to the lesser density second pattern which is connected to conductors 31 of a second substrate. These conductors 31 are of the lesser density also, and extend through a dielectric member 38 for being coupled to conductors (e.g., copper circuit pads) on the conducting member 40. The conductors may be coupled via a pin grid array socket, as shown, or by wires laterally deflectable into engagement with the conductors on the member 40 (Fig 3). Ready separability of various parts of the assembly is thus assured.

公开(公告)号：DE68914059T2

公开(公告)日：1994-10-20

申请号：DE68914059

申请日：1989-07-01

Applicant: IBM

Inventor： CHARSKY RONALD STEPHEN ,  OLSON LEONARD THEODORE ,  PAGNANI DAVID PETER

IPC: H05K9/00 ,  H01L23/14 ,  H01L23/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46

公开(公告)号：DE68914059D1

公开(公告)日：1994-04-28

申请号：DE68914059

申请日：1989-07-01

Applicant: IBM

Inventor： CHARSKY RONALD STEPHEN ,  OLSON LEONARD THEODORE ,  PAGNANI DAVID PETER

IPC: H05K9/00 ,  H01L23/14 ,  H01L23/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46