公开(公告)号：FR2312172A1

公开(公告)日：1976-12-17

申请号：FR7610362

申请日：1976-04-01

Applicant: IBM

Inventor： NESTORK WILLIAM J ,  PARIS JOHN A

IPC: H01L23/14 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18

Abstract: The substrate is connected to a metal pattern on a supporting substrate. The method involves making holes in a first plane monocrystal substrate (20); and application of a metallised system on this substrate, with contacts ending at the holes. Metal pins are inserted in the holes; and pins with preformed solder rings are provided. The arrangement is then heated until solder melts and flows in the holes with pins, thus connecting pins with the metallising system; A carrier substrate (12) is provided with a metallurgical system whose contact spots are arranged in a platform corresponding to that of holes in the SC substrate. The ends of the pins are connected with the contact spots.