公开(公告)号：DE3463626D1

公开(公告)日：1987-06-19

申请号：DE3463626

申请日：1984-11-16

Applicant: IBM

Inventor： MACINNES ROBERT DONALD ,  PERIU CARLOS CESAR ,  ROHR ROBERT LEWIS

IPC: H05K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K31/02 ,  F27D7/06 ,  B23K3/04

Abstract: An improved apparatus and method are disclosed for heating objects, such as electronic chips being bonded to substrates, in which a copper heat exchanger element (12) comprises a circuitous interior passage (26) through which gases pass from a source (30) to be heated by a heater (74) to a desired temperature and to be cleansed of unwanted oxygen by catalytic reaction, prior to entering a furnace chamber (22) heated from below by the heat exchanger element (12) and from above by a further heater (72) and copper plate (60), whereby essentially uniform gas temperature, acceptably low oxygen concentration and fast cycling times are provided in the furnace chamber (22).