公开(公告)号：DE2712167A1

公开(公告)日：1977-10-13

申请号：DE2712167

申请日：1977-03-19

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  ELMORE GLENN VAN NESS ,  PETER ANTHONY EDWARD

IPC: H05K3/28 ,  B23K1/00 ,  B23K35/22 ,  H05K3/00 ,  H05K3/34 ,  H01L21/60

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.

公开(公告)号：DE2911620A1

公开(公告)日：1979-10-11

申请号：DE2911620

申请日：1979-03-24

Applicant: IBM

Inventor： PETER ANTHONY EDWARD ,  SHOTT FRANK ANDREW ,  WEISS ROBERT LYNN

IPC: H01R12/04 ,  H01R12/51 ,  H05K1/00 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36