公开(公告)号：DE3871712D1

公开(公告)日：1992-07-09

申请号：DE3871712

申请日：1988-10-05

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  CARDEN TIMOTHY FRANCIS ,  CUTTING LAWRENCE RICHARD ,  ENGLE STEPHEN ROBERT ,  MOORE RONALD JAMES

IPC: C09K5/00 ,  C09K5/08 ,  H01L23/36

公开(公告)号：DE3266507D1

公开(公告)日：1985-10-31

申请号：DE3266507

申请日：1982-06-02

Applicant: IBM

Inventor： ABOLAFIA OSCAR ROBERT ,  AMEEN JOSEPH GEORGE ,  ELMORE GLENN VANNESS

IPC: C23F1/26 ,  H05K3/06 ,  C23F1/00 ,  C09K13/06

Abstract: An aqueous acidic composition suitable for etching which contains an acid and a thiourea compound, and use thereof.

公开(公告)号：DE3160606D1

公开(公告)日：1983-08-25

申请号：DE3160606

申请日：1981-01-08

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  JOSEPH CHARLES ARNOLD ,  RIVENBURGH DENNIS LOUIS ,  SISSENSTEIN DAVID WILLIAM

IPC: C11D7/50 ,  C01B7/01 ,  C07C17/00 ,  C07C17/38 ,  C07C17/389 ,  C07C17/42 ,  C07C21/04 ,  C07C67/00 ,  H05K3/26

公开(公告)号：DE3871712T2

公开(公告)日：1993-01-28

申请号：DE3871712

申请日：1988-10-05

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  CARDEN TIMOTHY FRANCIS ,  CUTTING LAWRENCE RICHARD ,  ENGLE STEPHEN ROBERT ,  MOORE RONALD JAMES

IPC: C09K5/00 ,  C09K5/08 ,  H01L23/36

公开(公告)号：DE3378416D1

公开(公告)日：1988-12-15

申请号：DE3378416

申请日：1983-12-06

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  HOGROGIAN RICHARD HARRY ,  SMEY SAMUEL LOUIS

IPC: B08B3/12 ,  C11D3/43 ,  C11D11/00 ,  C11D7/50 ,  H05K3/26

公开(公告)号：DE69301060T2

公开(公告)日：1996-07-04

申请号：DE69301060

申请日：1993-04-23

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  FUNARI JOSEPH ,  MOORE RONALD JAMES

IPC: B23K1/20 ,  H01L21/60 ,  B23K3/06 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

Abstract: A method of precisely depositing accurately defined quantities of solder (21) onto high density circuit patterns (23) on a substrate (25) without use of a solder mask or the like wherein solder paste (21) is originally deposited within a precisely defined transfer member (11) (e.g., graphite block having holes drilled therein), the transfer member (15) then being aligned relative to the respective circuitry such that when both block (11) and substrate (25) are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors (23), the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

公开(公告)号：DE69301060D1

公开(公告)日：1996-02-01

申请号：DE69301060

申请日：1993-04-23

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  FUNARI JOSEPH ,  MOORE RONALD JAMES

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/60 ,  H01L21/48 ,  H05K3/24 ,  H05K3/34

Abstract: A method of precisely depositing accurately defined quantities of solder (21) onto high density circuit patterns (23) on a substrate (25) without use of a solder mask or the like wherein solder paste (21) is originally deposited within a precisely defined transfer member (11) (e.g., graphite block having holes drilled therein), the transfer member (15) then being aligned relative to the respective circuitry such that when both block (11) and substrate (25) are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors (23), the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.

公开(公告)号：DE2712167A1

公开(公告)日：1977-10-13

申请号：DE2712167

申请日：1977-03-19

Applicant: IBM

Inventor： AMEEN JOSEPH GEORGE ,  ELMORE GLENN VAN NESS ,  PETER ANTHONY EDWARD

IPC: H05K3/28 ,  B23K1/00 ,  B23K35/22 ,  H05K3/00 ,  H05K3/34 ,  H01L21/60

Abstract: A polysulfone base stop resist material to protect gold thermocompression bonding sites on a circuit module during a solder dipping operation. Along with the thermoplastic, thermostable strippable base of polysulfone, the resist includes a solvent for the polysulfone and a filler which holds the melted polysulfone in place during the solder dipping operation.