公开(公告)号：CA2575845A1

公开(公告)日：2006-03-02

申请号：CA2575845

申请日：2005-02-23

Applicant: IBM

Inventor： GAUCHER BRIAN PAUL ,  LIU DUIXIAN ,  PFEIFFER ULLRICH RICHARD RUDOL ,  ZWICK THOMAS MARTIN

IPC: H01Q23/00 ,  H01L21/60 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30

Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.