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公开(公告)号：CA2575845C
公开(公告)日：2013-02-19
申请号：CA2575845
申请日：2005-02-23
Applicant: IBM
Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems. For example, an exemplary antenna device (20) comprises a substrate (21) having a dipole antenna comprising a first wire element (22) connected to and supported by metallic pads (23) and (24), and a second wire element (25) connected to and supported by metallic pads (26) and (27). The metallic pads (23) and (26) are contact pads to an integrated antenna feed network connected to an RF circuit, for example. The metallic pads (24) and (27) are termination pads for attaching and supporting the end (non-fed) portions of respective wire elements (22) and (25). Optional metallic shielding elements (28) and (29) are formed on the substrate/chip (21) under respective wire elements (22) and (25) to prevent electromagnetic fields from penetrating into the substrate (21) thereby reducing loss and improving the antenna efficiency.
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公开(公告)号：CA2575845A1
公开(公告)日：2006-03-02
申请号：CA2575845
申请日：2005-02-23
Applicant: IBM
Abstract: Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
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