公开(公告)号：GB2293918A

公开(公告)日：1996-04-10

申请号：GB9420191

申请日：1994-10-06

Applicant: IBM

Inventor： COX ALLEN RONALD ,  SMITH KENNETH GEORGE ,  PFLUGHAUPT LOUIS ELLIOTT ,  COWBURN ANTHONY R ,  MEDLOCK KATHERINE MARGARET ,  SAVAGE CLIVE PETER

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48

Abstract: An electronic circuit package comprises a carrier (11), a microchip (12), which has bond pads (13) and is attached to the carrier, and a flexible circuit comprising a first flexible circuit element cable (15) attached to the region of the carrier adjacent the microchip and a second flexible circuit element cable (17) attached to and stepped back from the first cable. Each element includes an electrically conductive circuit pattern defined thereon with selected ones of the microchip bond pads (13) being electrically connected by wirebonds (16) to a circuit pattern on the first element of the flexible circuit and further selected ones of the bond pads being electrically connected by wirebonds to the circuit pattern of the second element.

公开(公告)号：AU1481370A

公开(公告)日：1971-11-18

申请号：AU1481370

申请日：1970-05-08

Applicant: IBM

Inventor： PFLUGHAUPT LOUIS ELLIOTT

IPC: G11B5/027 ,  G11B5/17 ,  G11B5/29 ,  G11B5/60 ,  G11B20/24 ,  G11B

Abstract: 1307861 Magnetic heads INTERNATIONAL BUSINESS MACHINES CORP 4 May 1970 [28 May 1969] 21302/70 Heading G5R In a multitrack magnetic head in which each element 11 has a bifilar winding, each filament 21, 22 of the inner element(s) 23 has a turn about the core 25, 26 of adjacent elements in the opposite sense to its main winding so as to compensate for signals induced in that winding from the adjacent elements. The windings are connected to a differential amplifier 24 with a high common mode of rejection by an integrated circuit diode matrix 15 incorporated in the head. The individual elements consist of cores 11 glass-bonded to a common ferrite block 10.