公开(公告)号：GB2293918A

公开(公告)日：1996-04-10

申请号：GB9420191

申请日：1994-10-06

Applicant: IBM

Inventor： COX ALLEN RONALD ,  SMITH KENNETH GEORGE ,  PFLUGHAUPT LOUIS ELLIOTT ,  COWBURN ANTHONY R ,  MEDLOCK KATHERINE MARGARET ,  SAVAGE CLIVE PETER

IPC: H01L23/31 ,  H01L23/498 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48

Abstract: An electronic circuit package comprises a carrier (11), a microchip (12), which has bond pads (13) and is attached to the carrier, and a flexible circuit comprising a first flexible circuit element cable (15) attached to the region of the carrier adjacent the microchip and a second flexible circuit element cable (17) attached to and stepped back from the first cable. Each element includes an electrically conductive circuit pattern defined thereon with selected ones of the microchip bond pads (13) being electrically connected by wirebonds (16) to a circuit pattern on the first element of the flexible circuit and further selected ones of the bond pads being electrically connected by wirebonds to the circuit pattern of the second element.

公开(公告)号：GB2292004A

公开(公告)日：1996-02-07

申请号：GB9415297

申请日：1994-07-29

Applicant: IBM UK ,  HAVANT INT GROUP LTD ,  HAVANT INTERNATIONAL LTD

Inventor： MEDLOCK KATHERINE MARGARET ,  COWBURN ANTHONY R ,  SAVAGE CLIVE PETER ,  MORGAN WILLIAM M

IPC: H01L23/498 ,  H01L23/48

Abstract: An electronic circuit package comprises a carrier substrate 20 e.g. in the form of a flexible circuit, having a plurality of electrical contacts 40 - 45 defined thereon, an integrated circuit device 10 mounted on the substrate including a plurality of terminals 30, 32, 50 - 54 located towards the periphery of the device, the plurality of terminals being individually connected by means of conductive wires 31 to a corresponding electrical contact on the substrate. The package further comprises a conductive path means 150 acting as a conductive bridge between a selected device terminal eg 50 and an associated electrical contact on the substrate 43, the conductive path means comprising a conductive region defined in or on an outward facing surface of the device, the selected terminal eg 50 connected by a first conductive wire 180 to the conductive region 162, 166 which is in turn connected by a second conductive wire 182 to the associated electrical contact 108. The conductive region is advantageously formed in a separate circuit element e.g. a flexible circuit which is bonded onto the surface of the device.

公开(公告)号：GB2292003A

公开(公告)日：1996-02-07

申请号：GB9415296

申请日：1994-07-29

Applicant: IBM UK ,  HAVANT INT GROUP LTD ,  HAVANT INTERNATIONAL LTD

Inventor： MEDLOCK KATHERINE MARGARET ,  COWBURN ANTHONY R ,  SAVAGE CLIVE PETER ,  MORGAN WILLIAM M

IPC: H01L23/13 ,  H01L23/14 ,  H01L23/24 ,  H01L23/48

Abstract: The area required for wirebond direct chip attach on a flexible substrate 30 is reduced by countersinking the chip 10. A spacer layer 70 or an indentation in a heatsink 20 may be used to recess a chip 10 relative to a flexible substrate 30. This enables shorter wirebonds 40 and less encapsulation 60 to be employed. A protection layer 50 is applied over a wiring pattern carried by the substrate 30.