公开(公告)号：DE3771387D1

公开(公告)日：1991-08-22

申请号：DE3771387

申请日：1987-04-28

Applicant: IBM

Inventor： BULLER MARVIN LAWRENCE ,  LUMBRA DOUGLAS LEON ,  PHELPS DOUGLAS WALLACE ,  SAMUELSEN SIGVART JOHN ,  WARD WILLIAM CARROLL

IPC: H01L23/34 ,  H01L23/04 ,  H01L23/36 ,  H01L23/433 ,  H01L23/42

Abstract: Heat generated by a semiconductor chip device (10) mounted on a substrate (14) is dissipated through thermally conductive wires (36) which are welded to the device and to a thermally conductive cover (20) disposed over the device. The wires can be of annealed aluminium and ultrasonically welded to heat generating locations on the device and to a part (54) of the cover which is electrically isolated from the remainder of the cover.

公开(公告)号：DE3275789D1

公开(公告)日：1987-04-23

申请号：DE3275789

申请日：1982-11-23

Applicant: IBM

Inventor： MARKS ROBERT ,  PHELPS DOUGLAS WALLACE ,  WARD WILLIAM CARROLL

IPC: H05K3/34 ,  H01L21/60 ,  H01L23/538 ,  H05K3/32 ,  H05K3/40 ,  H01L23/52

Abstract: A novel substrate (10) is disclosed which can mount either flip-chip solder bonded IC chips (12) or wire bonded chips (18), or both chips, or a single chip having both solder bonds and wire bond. The substrate has an array of solder pads (26,28) which will accept solder bonds. Those pads (28) which are to be used for wire bonding have mounted thereon a trimetallic pedestal (30). Each pedestal has a layer (32) of solder metal bonded to the solder pad, a top layer metal (34) suitable for wire bonding, such as, aluminum or gold, and an intermediate layer (36) of metal, such as nickel, which is impervious to both solder metal and the top layer metal.

公开(公告)号：DE3264040D1

公开(公告)日：1985-07-11

申请号：DE3264040

申请日：1982-07-23

Applicant: IBM

Inventor： LUMBRA DOUGLAS LEON ,  PHELPS DOUGLAS WALLACE ,  SAMUELSEN SIGVART JOHN ,  WARD WILLIAM CARROLL

IPC: B23K9/073 ,  B23K9/20 ,  B23K9/22

Abstract: In this technique a test voltage no greater than the initiating voltage for the arc is first applied across the pieces (12, 18) to be welded. The welding cycle is then performed if, and only if, an arc is detected by a photodetector (22, 24), which are results from the test voltage.