公开(公告)号：DE3771387D1

公开(公告)日：1991-08-22

申请号：DE3771387

申请日：1987-04-28

Applicant: IBM

Inventor： BULLER MARVIN LAWRENCE ,  LUMBRA DOUGLAS LEON ,  PHELPS DOUGLAS WALLACE ,  SAMUELSEN SIGVART JOHN ,  WARD WILLIAM CARROLL

IPC: H01L23/34 ,  H01L23/04 ,  H01L23/36 ,  H01L23/433 ,  H01L23/42

Abstract: Heat generated by a semiconductor chip device (10) mounted on a substrate (14) is dissipated through thermally conductive wires (36) which are welded to the device and to a thermally conductive cover (20) disposed over the device. The wires can be of annealed aluminium and ultrasonically welded to heat generating locations on the device and to a part (54) of the cover which is electrically isolated from the remainder of the cover.

公开(公告)号：DE3264040D1

公开(公告)日：1985-07-11

申请号：DE3264040

申请日：1982-07-23

Applicant: IBM

Inventor： LUMBRA DOUGLAS LEON ,  PHELPS DOUGLAS WALLACE ,  SAMUELSEN SIGVART JOHN ,  WARD WILLIAM CARROLL

IPC: B23K9/073 ,  B23K9/20 ,  B23K9/22

Abstract: In this technique a test voltage no greater than the initiating voltage for the arc is first applied across the pieces (12, 18) to be welded. The welding cycle is then performed if, and only if, an arc is detected by a photodetector (22, 24), which are results from the test voltage.