公开(公告)号：DE2862413D1

公开(公告)日：1984-07-05

申请号：DE2862413

申请日：1978-12-13

Applicant: IBM

Inventor： BAKOS PETER ,  HAGGETT ROGER EUGENE ,  POLIAK RICHARD MARTIN

IPC: H05K3/34 ,  B23K35/36 ,  C09D5/20 ,  C09D171/02 ,  H01B3/42 ,  H01L23/29 ,  H01L23/488 ,  H05K3/28 ,  C09D3/49 ,  C08L71/02

Abstract: A film-forming composition comprising an organic flux base material; and a carboxylic acid anhydride and/or aldehyde; and a process for using are provided.

公开(公告)号：DE3065723D1

公开(公告)日：1983-12-29

申请号：DE3065723

申请日：1980-11-20

Applicant: IBM

Inventor： BAKOS PETER ,  DARROW RUSSELL ELWOOD ,  FUNARI JOSEPH ,  POLIAK RICHARD MARTIN

IPC: C11D7/50 ,  C09D9/00 ,  H05K3/28

公开(公告)号：DE2231299A1

公开(公告)日：1973-01-11

申请号：DE2231299

申请日：1972-06-26

Applicant: IBM

Inventor： ANGELO RAYMOND WILLIAM ,  BALAN ALBERT LAWRENCE ,  HUETTNER DAVID JOSEPH ,  POLIAK RICHARD MARTIN ,  SHIPLEY JOHN FRANK

IPC: B23K35/36

公开(公告)号：GB1301076A

公开(公告)日：1972-12-29

申请号：GB1482571

申请日：1971-05-13

Applicant: IBM

Inventor： POLIAK RICHARD MARTIN ,  RAUCH LESLIE DEFOREST

IPC: B23K35/36

Abstract: 1301076 Solder flux INTERNATIONAL BUSINESS MACHINES CORP 13 May 1971 [27 July 1970] 14825/71 Heading C7M [Also in Division C4] A solder flux comprises a rosin and a cationic fluorocarbon, preferably 20-68% weight resin, 0À01-1% weight fluorocarbon and the balance organic solvent or 99-99À99% rosin and 0À1-1% fluorocarbon. The fluorocarbon has the general formula YCF 2 (CF 2 ) p - X where Y is a moiety to complete the fluorocarbon chain such as H or F, X is a solubilizing group and p is a positive integer. The fluorocarbon is preferably (1) a quaternary ammonium fluorocarbon, (2) an ammonium fluorocarboxylate or (3) a perfluorocarboxylic acid or its salts which have the following general formulae:- (1) Cn F 2n+1 CONHC 3 H 6 N(CH 3 ) q C r H 2r+1 X where n is 6 to 9, q is 2 or 3, r is 0 to 2 and X is a halide. (2) H(CF 2 ) n COONH 4 where n is 8 or 10. (3) HCF 2 (CF 2 ) s COOM where S is 5 to 8 and M is hydrogen or a group forming a salt. The rosin is preferably water white rosin and the prefered organic solvent is a C 1 to C 3 primary alcohol e.g. isopropyl alcohol. Acetone, 2-ethoxyethanol and ethylene glycol may also be used. The flux preferably contains 2-3% glycerine. The flux may be used as a liquid, paste, coating or as a powder. The exemplified flux contains in weight per cent 37À99% water white rosin, 60% isopropyl alcohol, 2% glycerine and 0À01% F(CF 2 ) 7 CONHC 3 H 6 N(C 2 H 5 )CHI. It is primarily used in electronics for soldering Cu, Sn, Sn-Pb, Au or Ag.