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公开(公告)号：DE69112164T2
公开(公告)日：1996-05-02
申请号：DE69112164
申请日：1991-09-06
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , POOLER RODNEY ARREND
Abstract: Deposition of heated solder onto a plurality of conductive pads 18 which are disposed in one or more linear arrays on a circuit board is effected by a robotically controlled arm on which is mounted a solder nozzle. The solder nozzle is first manipulated to a selected point A offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad B and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated C, D at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points 72 or other areas which do not require solder deposition.
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公开(公告)号：DE69112164D1
公开(公告)日：1995-09-21
申请号：DE69112164
申请日：1991-09-06
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , POOLER RODNEY ARREND
Abstract: Deposition of heated solder onto a plurality of conductive pads 18 which are disposed in one or more linear arrays on a circuit board is effected by a robotically controlled arm on which is mounted a solder nozzle. The solder nozzle is first manipulated to a selected point A offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad B and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated C, D at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points 72 or other areas which do not require solder deposition.
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