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公开(公告)号：DE69105684T2
公开(公告)日：1995-05-24
申请号：DE69105684
申请日：1991-09-04
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , LEDERMANN PETER G , NGUYEN ALVIN D , STEINBACH STEPHEN C , YU STANLEY K
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Patent Agency Ranking
公开(公告)号：DE69112164D1
公开(公告)日：1995-09-21
申请号：DE69112164
申请日：1991-09-06
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , POOLER RODNEY ARREND
Abstract: Deposition of heated solder onto a plurality of conductive pads 18 which are disposed in one or more linear arrays on a circuit board is effected by a robotically controlled arm on which is mounted a solder nozzle. The solder nozzle is first manipulated to a selected point A offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad B and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated C, D at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points 72 or other areas which do not require solder deposition.
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公开(公告)号：DE69108336D1
公开(公告)日：1995-04-27
申请号：DE69108336
申请日：1991-09-13
Applicant: IBM
Inventor： HICKS CHRISTOPHER A
Abstract: The method and apparatus are provided to permit the accurate sensing of the height of a solder nozzle above a circuit board during operation of the solder nozzle. A non-contact limit switch 30, which provides an indication of the presence of a planar surface at a preselected proximity, is mounted in a fixed relationship with a solder nozzle 12 which is manipulatable by means of a robotic arm 18. A reference surface 38 is provided which includes a proximity sensor, such as a through beam fibre optic switch 42. The proximity sensor is mounted a predetermined distance above the reference surface and is utilized to detect the solder nozzle as it is moved toward the reference surface. By noting the position coordinates of the robotic arm at which the proximity sensor indicates the presence of the solder nozzle at the predetermined distance above the reference surface, and the position of the robotic arm at which the non-contact limit switch closes in response to the proximity of the reference surface, it is possible to accurately calculate a calibration offset value which may be utilized in conjunction with the output of the non-contact limit switch to precisely position the solder nozzle at a desired distance above a circuit board.
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公开(公告)号：DE69112164T2
公开(公告)日：1996-05-02
申请号：DE69112164
申请日：1991-09-06
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , POOLER RODNEY ARREND
Abstract: Deposition of heated solder onto a plurality of conductive pads 18 which are disposed in one or more linear arrays on a circuit board is effected by a robotically controlled arm on which is mounted a solder nozzle. The solder nozzle is first manipulated to a selected point A offset in a known direction and distance from a first conductive pad by means of a data set which specifies the centroid and footprint for a selected group of conductive pads. After feeding solder into the solder nozzle, aligning the solder nozzle at a desired angle parallel to a linear array of conductive pads and lowering the solder nozzle until a solder droplet contacts the circuit board, the solder nozzle is manipulated at a substantially constant velocity toward the first conductive pad B and thereafter along a selected line which tracks the linear array of conductive pads. To avoid solder starvation at the last few pads in a linear array, the solder nozzle is manipulated C, D at a selected angle away from the selected line while decreasing the solder nozzle velocity. The angle of departure from the selected line is preferably an acute angle selected so that the solder nozzle avoids contact with alignment points 72 or other areas which do not require solder deposition.
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公开(公告)号：DE69108336T2
公开(公告)日：1995-10-12
申请号：DE69108336
申请日：1991-09-13
Applicant: IBM
Inventor： HICKS CHRISTOPHER A
Abstract: The method and apparatus are provided to permit the accurate sensing of the height of a solder nozzle above a circuit board during operation of the solder nozzle. A non-contact limit switch 30, which provides an indication of the presence of a planar surface at a preselected proximity, is mounted in a fixed relationship with a solder nozzle 12 which is manipulatable by means of a robotic arm 18. A reference surface 38 is provided which includes a proximity sensor, such as a through beam fibre optic switch 42. The proximity sensor is mounted a predetermined distance above the reference surface and is utilized to detect the solder nozzle as it is moved toward the reference surface. By noting the position coordinates of the robotic arm at which the proximity sensor indicates the presence of the solder nozzle at the predetermined distance above the reference surface, and the position of the robotic arm at which the non-contact limit switch closes in response to the proximity of the reference surface, it is possible to accurately calculate a calibration offset value which may be utilized in conjunction with the output of the non-contact limit switch to precisely position the solder nozzle at a desired distance above a circuit board.
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公开(公告)号：DE69105684D1
公开(公告)日：1995-01-19
申请号：DE69105684
申请日：1991-09-04
Applicant: IBM
Inventor： HAYDEN TERRY F , HICKS CHRISTOPHER A , LEDERMANN PETER G , NGUYEN ALVIN D , STEINBACH STEPHEN C , YU STANLEY K
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