公开(公告)号：JPH02296334A

公开(公告)日：1990-12-06

申请号：JP9781890

申请日：1990-04-16

Applicant: IBM

Inventor： KENESU PAAKAA ROTSUDOBERU ,  POORU ANSONIII TOTSUTA ,  JIEEMUZU FURANSHISU HOWAITO

IPC: H01L23/52 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/16 ,  H05K3/38

Abstract: PURPOSE: To obtain a copper aluminum conductor having a superior electromigration characteristic and a low weight percentage of copper by providing an intermetallic compound layer on the surface of a copper aluminum layer to which a copper of