公开(公告)号：JPS5492176A

公开(公告)日：1979-07-21

申请号：JP13464178

申请日：1978-11-02

Applicant: IBM

Inventor： UEIIKAN CHIYU ,  JIEEMUSU KENTO HAWAADO ,  JIEEMUZU FURANSHISU HOWAITO

IPC: H01L29/43 ,  H01L21/28 ,  H01L21/285 ,  H01L21/338 ,  H01L21/768 ,  H01L23/532 ,  H01L29/47 ,  H01L29/872

公开(公告)号：JPH02296334A

公开(公告)日：1990-12-06

申请号：JP9781890

申请日：1990-04-16

Applicant: IBM

Inventor： KENESU PAAKAA ROTSUDOBERU ,  POORU ANSONIII TOTSUTA ,  JIEEMUZU FURANSHISU HOWAITO

IPC: H01L23/52 ,  H01L21/28 ,  H01L21/285 ,  H01L21/3205 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/16 ,  H05K3/38

Abstract: PURPOSE: To obtain a copper aluminum conductor having a superior electromigration characteristic and a low weight percentage of copper by providing an intermetallic compound layer on the surface of a copper aluminum layer to which a copper of

公开(公告)号：JPS5637672A

公开(公告)日：1981-04-11

申请号：JP8150780

申请日：1980-06-18

Applicant: IBM

Inventor： JIEEMUZU KENTO HAWAADO ,  JIEEMUZU FURANSHISU HOWAITO

IPC: H01L21/768 ,  H01L21/28 ,  H01L23/532 ,  H01L29/43 ,  H01L29/47