公开(公告)号：DE3767737D1

公开(公告)日：1991-03-07

申请号：DE3767737

申请日：1987-03-20

Applicant: IBM

Inventor： JONES GERALD WALTER ,  PRATT WILLIAM ROBERT ,  SUMMA WILLIAM JOSEPH

IPC: G01N21/88 ,  G01N21/956 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46

Abstract: A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs ultraviolet light in the 320-440 nm region. The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.