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Patent Agency Ranking
公开(公告)号：DE3788564T2
公开(公告)日：1994-06-30
申请号：DE3788564
申请日：1987-10-20
Applicant: IBM
Inventor： BABU SURYADEVARA V , JONES GERALD WALTER , LU NENG-HSING DR
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公开(公告)号：DE3767737D1
公开(公告)日：1991-03-07
申请号：DE3767737
申请日：1987-03-20
Applicant: IBM
Inventor： JONES GERALD WALTER , PRATT WILLIAM ROBERT , SUMMA WILLIAM JOSEPH
IPC: G01N21/88 , G01N21/956 , H05K1/00 , H05K1/02 , H05K3/46
Abstract: A method is disclosed for the visual inspection of electrical circuitry deposited in the layers of a multilayer printed circuit board wherein the dielectric layers of the multilayer board are prepared using a clear, light transparent thermosetting resin having incorporated therein a dye which is permeable to visible light but which absorbs ultraviolet light in the 320-440 nm region. The electrical circuitry in the board can be easily traced by an observer upon illumination of the board by visible light.
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公开(公告)号：DE3788564D1
公开(公告)日：1994-02-03
申请号：DE3788564
申请日：1987-10-20
Applicant: IBM
Inventor： BABU SURYADEVARA V , JONES GERALD WALTER , LU NENG-HSING DR
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公开(公告)号：SG75906A1
公开(公告)日：2000-10-24
申请号：SG1998005900
申请日：1998-12-22
Applicant: IBM
Inventor： JONES GERALD WALTER , KEESLER ROSS WILLIAM , MARKOVICH VOYA RISTA , RUDIK WILLIAM JOHN , WILSON JAMES WARREN , WILSON WILLIAM EARL
Abstract: A process of fabricating a circuitized structure is provided. The process includes the steps of providing an organic substrate having circuitry thereon; applying a dielectric film on the organic substrate; forming microvias in the dielectric film; sputtering a metal seed layer on the dielectric film and the microvias; plating a metallic layer on the metal seed layer; and forming a circuit pattern thereon.
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