公开(公告)号：US3691864A

公开(公告)日：1972-09-19

申请号：US3691864D

申请日：1970-11-19

Applicant: IBM

Inventor： COCHRAN THOMAS J ,  HAZEL HERBERT K ,  RANCE WILLIAM G JR

IPC: B23Q1/48 ,  H05K13/00 ,  G05G15/06

CPC classification number: H05K13/0015 ,  B23Q1/48 ,  Y10T29/53061 ,  Y10T29/53265 ,  Y10T74/20348

Abstract: An improved system is provided for positioning a circuit board with respect to wire handling and bonding apparatus. The board is movable in an X-Y plane, can be raised or lowered along a Z dimension axis, and can be rotated about the Z dimension axis. Separate X, Y, Z, and rotational dimension electric motors are mounted on a stationary base. A differential mechanism couples an X positioning mechanism to respond to the difference between the X dimension motor position and the rotational dimension motor position. The differential mechanism prevents changes in the rotational position of the X positioning mechanism from affecting the X dimension position. A similar differential mechanism couples the Y positioning mechanism to the Y drive motor and to the rotational dimension drive motor.

Abstract translation: 提供了一种改进的系统，用于相对于线处理和接合装置定位电路板。 该板可以在X-Y平面上移动，可以沿着Z尺寸轴升高或降低，并可绕Z轴旋转。 分离的X，Y，Z和旋转尺寸的电动机安装在固定的基座上。 差速机构连接X定位机构以响应X尺寸电动机位置和旋转尺寸电动机位置之间的差异。 差速机构防止X定位机构的旋转位置的变化影响X尺寸位置。 类似的差速机构将Y定位机构连接到Y驱动电机和旋转尺寸驱动电机。