X-y rotational positioning system
    4.
    发明授权
    X-y rotational positioning system 失效
    X-Y旋转定位系统

    公开(公告)号:US3691864A

    公开(公告)日:1972-09-19

    申请号:US3691864D

    申请日:1970-11-19

    Applicant: IBM

    Abstract: An improved system is provided for positioning a circuit board with respect to wire handling and bonding apparatus. The board is movable in an X-Y plane, can be raised or lowered along a Z dimension axis, and can be rotated about the Z dimension axis. Separate X, Y, Z, and rotational dimension electric motors are mounted on a stationary base. A differential mechanism couples an X positioning mechanism to respond to the difference between the X dimension motor position and the rotational dimension motor position. The differential mechanism prevents changes in the rotational position of the X positioning mechanism from affecting the X dimension position. A similar differential mechanism couples the Y positioning mechanism to the Y drive motor and to the rotational dimension drive motor.

    Abstract translation: 提供了一种改进的系统,用于相对于线处理和接合装置定位电路板。 该板可以在X-Y平面上移动,可以沿着Z尺寸轴升高或降低,并可绕Z轴旋转。 分离的X,Y,Z和旋转尺寸的电动机安装在固定的基座上。 差速机构连接X定位机构以响应X尺寸电动机位置和旋转尺寸电动机位置之间的差异。 差速机构防止X定位机构的旋转位置的变化影响X尺寸位置。 类似的差速机构将Y定位机构连接到Y驱动电机和旋转尺寸驱动电机。

    FINE WIRE TWISTED PAIR ROUTING AND CONNECTING SYSTEM

    公开(公告)号:CA1035557A

    公开(公告)日:1978-08-01

    申请号:CA231475

    申请日:1975-07-15

    Applicant: IBM

    Inventor: HAZEL HERBERT K

    Abstract: Apparaus for automatically bonding pre-twisted wires to a number of pairs of ground and current contact points on a workpiece or substrate is disclosed. The apparatus forms a loop in the pre-twisted wires and bonds each wire to a ground or current contact point. The pre-twisted wire is then routed to the next pair of ground and current contact point for bonding.

    9.
    发明专利
    未知

    公开(公告)号:FR2281035A1

    公开(公告)日:1976-02-27

    申请号:FR7518981

    申请日:1975-06-09

    Applicant: IBM

    Inventor: HAZEL HERBERT K

    Abstract: Apparaus for automatically bonding pre-twisted wires to a number of pairs of ground and current contact points on a workpiece or substrate is disclosed. The apparatus forms a loop in the pre-twisted wires and bonds each wire to a ground or current contact point. The pre-twisted wire is then routed to the next pair of ground and current contact point for bonding.

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