公开(公告)号：JP2000068277A

公开(公告)日：2000-03-03

申请号：JP21494799

申请日：1999-07-29

Applicant: IBM

Inventor： ENGLISH GEORGE ,  KEINERT JOACHIM ,  RETTIG OLIVER DR

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/82 ,  H01L23/48

Abstract: PROBLEM TO BE SOLVED: To effectively design a semiconductor integrated circuit or an electronic package without considerably increasing complexity of data or reducing wire resistance, by dividing a wide metallic area into metallic stripes. SOLUTION: A physical designing step includes the step of dividing a wide metallic area 4 into metallic stripes 2. The wide metallic area 4 is preferably separated into the stripes 2 which belong to a single wire segment, and vias 6 are inserted only into overlapping parts between metallic layers. An upper metallic layer is provided with an electronic structural element, preferably a C4 pad area 8 for mounting a chip. A blockage is set so as to prevent metallic segments from overlapping the C4 pad area 8. A long power line is divided from an edge to another edge, is formed into stripes on a part on which the C4 pad area 8 is not disposed, and is divided on a part on which the C4 pad area 8 is disposed.