公开(公告)号：JP2005167248A

公开(公告)日：2005-06-23

申请号：JP2004347678

申请日：2004-11-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： RICHARD C CHUU ,  ELLSWORTH JR MICHAEL J ,  SCHMIDT ROGER R ,  SIMONS ROBERT E ,  ZOODSMA RANDY J

IPC: G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC classification number: H05K7/2079

Abstract: PROBLEM TO BE SOLVED: To provide a liquid cooling system using a plurality of coolant temperature controlling units (CCUs) such that a function is not stopped because of the trouble of a heat exchanger, a control valve, the loss of a cooling water source or the like. SOLUTION: Each CCU 310 of a plurality of the coolant temperature controlling units (CCU) out of a plurality of electronic racks that should be cooled is coupled to one electronics rack 330 that is different and incidental to, and is provided with the heat exchanger, first cooling loops provided with the control valve and second cooling loops 315, 316. The first cooling loops receive an objective cooling facility coolant from the source, and at least a part of the coolant is allowed to pass through the heat exchanger through the control valve. The second cooling loops 315, 316 supply an objective system coolant to the incidental electronics rack 330, and in the heat exchanger, the heat is diffused in the objective cooling facility coolant in the first cooling loops from the electronics rack 330. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种使用多个冷却剂温度控制单元（CCU）的液体冷却系统，使得由于热交换器，控制阀的故障，功能不会停止，冷却的损失 水源等。 解决方案：应当冷却的多个电子机架中的多个冷却剂温度控制单元（CCU）的每个CCU 310被耦合到一个电子机架330，该电子机架330不同于并附带并提供有 热交换器，设置有控制阀和第二冷却回路315,316的第一冷却回路。第一冷却回路从源接收目标冷却设备冷却剂，并且允许至少一部分冷却剂通过热交换器通过 控制阀。 第二冷却回路315,316将物理系统冷却剂提供给附带的电子机架330，并且在热交换器中，热量在目标冷却设备中从电子机架330扩散到第一冷却回路中的冷却剂中。 （C）2005，JPO＆NCIPI

公开(公告)号：JP2000307282A

公开(公告)日：2000-11-02

申请号：JP2000075070

申请日：2000-03-17

Applicant: IBM

Inventor： RICHARD C CHUU ,  GREGORY M CHRYSLER ,  ROBERT E SIMONS

IPC: F25B1/00 ,  F25B5/02 ,  H01L23/473 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To enable to operate a computer system at a low temperature by constituting a refrigerating means by connecting to a closed loop including a cold plate through an enclosure by a refrigerant pipeline. SOLUTION: An enclosure 10 is provided with a component, i.e., a module covered by a cold plate 50 and is in thermal contact with it. The cold plate 50 is connected to an air-refrigerant heat exchanger 60 by a refrigerant pipeline 25. The pipeline is diverted from a flow through the cold plate 50 to allow a refrigerant to flow through the air-refrigerant heat exchanger 60, and a blower 70 blows air at both ends of the heat exchanger. Then, the refrigerant is cooled in the air-heat exchanger 60, and is circulated over a plurality of chips 42 to cool them. Thus, a computer system can be operated at a low temperature.

公开(公告)号：JP2005191554A

公开(公告)日：2005-07-14

申请号：JP2004347711

申请日：2004-11-30

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： RICHARD C CHUU ,  ELLSWORTH JR MICHAEL J ,  SCHMIDT ROGER R ,  SIMONS ROBERT E ,  TSUKAMOTO TAKESHI

IPC: F25D17/02 ,  F25D9/00 ,  G06F1/20 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To prevent a cooling system of a computer room from breaking down owing to heat exchanger failure or control valve failure, or loss of chilled water source. SOLUTION: A cooling system comprises at least two modular cooling units (MCU) and each MCU 310 provides system coolant to multiple electronics subsystems. The each MCU 310 comprises a heat exchanger 324, a first cooling loop 325 with at least one control valve 316, and a second cooling loop 327. The first cooling loop 325 receives chilled facility coolant from a source and passes at least a portion thereof through the heat exchanger. The second cooling loop supplies chilled system coolant to the multiple electronics subsystems and, in the heat exchanger 324, heat is expelled from the multiple electronics subsystems to the chilled facility coolant in the first cooling loop 325. At least one of control valve 316 controls flow and temperature of the facility coolant. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：防止计算机房的冷却系统由于热交换器故障或控制阀故障而损坏，或冷却水源的损失。 解决方案：冷却系统包括至少两个模块化冷却单元（MCU），并且每个MCU 310向多个电子子系统提供系统冷却剂。 每个MCU 310包括热交换器324，具有至少一个控制阀316的第一冷却回路325和第二冷却回路327.第一冷却回路325接收来自源的冷却设备冷却剂并使其至少一部分通过 热交换器。 第二冷却回路向多个电子子系统提供冷却系统冷却剂，并且在热交换器324中，热量从多个电子系统子系统排出到第一冷却回路325中的冷冻设备冷却剂。控制阀316中的至少一个控制流量 和设备冷却液的温度。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2000294706A

公开(公告)日：2000-10-20

申请号：JP2000075052

申请日：2000-03-17

Applicant: IBM

Inventor： RICHARD C CHUU ,  GREGORY M CHRYSLER

IPC: F25B39/02 ,  F25B43/00 ,  H01L23/34 ,  H01L23/427 ,  H01L23/473 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To obtain a cooling device which can prevent cooling substance in a liquid state from returning to a compressor. SOLUTION: An auxiliary heat mechanism 20 functions to return a refrigerant in an evaporation type cooling plate 10 for an electronic module 40 to a compressor in a vapor state. Based on measured values of pressure and temperature of the refrigerant exiting from the cooling plate 10, a control unit controls ON and OFF operation of an electric-resistive auxiliary heating element 21 in order to compensate for a variation in heat dissipation caused in the module 40. Additional heat can be supplied by a single planar element or inline heating element. The auxiliary heating mechanism 20 prevents the refrigerant substance from returning to the compressor which adversely affects the life or operating efficiency of the compressor.