公开(公告)号：JP2000307282A

公开(公告)日：2000-11-02

申请号：JP2000075070

申请日：2000-03-17

Applicant: IBM

Inventor： RICHARD C CHUU ,  GREGORY M CHRYSLER ,  ROBERT E SIMONS

IPC: F25B1/00 ,  F25B5/02 ,  H01L23/473 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To enable to operate a computer system at a low temperature by constituting a refrigerating means by connecting to a closed loop including a cold plate through an enclosure by a refrigerant pipeline. SOLUTION: An enclosure 10 is provided with a component, i.e., a module covered by a cold plate 50 and is in thermal contact with it. The cold plate 50 is connected to an air-refrigerant heat exchanger 60 by a refrigerant pipeline 25. The pipeline is diverted from a flow through the cold plate 50 to allow a refrigerant to flow through the air-refrigerant heat exchanger 60, and a blower 70 blows air at both ends of the heat exchanger. Then, the refrigerant is cooled in the air-heat exchanger 60, and is circulated over a plurality of chips 42 to cool them. Thus, a computer system can be operated at a low temperature.

公开(公告)号：JP2001024127A

公开(公告)日：2001-01-26

申请号：JP2000192392

申请日：2000-06-27

Applicant: IBM

Inventor： CHU RICHARD C ,  ELLSWORTH JR MICHAEL J ,  ROBERT E SIMONS

IPC: H01L23/473 ,  H05K1/02 ,  H05K5/02 ,  H05K7/20

Abstract: PROBLEM TO BE SOLVED: To provide a humidity adjustment system and a humidity adjustment method of a low temperature electronic device assembly which keep the surface of the low temperature electronic device assembly at a temperature higher than the environmental dew point. SOLUTION: A humidity adjustment system includes a 1st heat insulating layer 5 which surrounds and is brought into contact with a cooled electronic device at least partially, and 2nd heat insulating layers 3 and 19 which surrounds the 1st heat insulating layer 5 and the cooled electronic device to define the internal space between the 1st heat insulating layer 5 and the 2nd heat insulating layers 3 and 19. A heater assembly functions as an interface between the electronic device and the internal space, and heats the internal space to a temperature high enough to keep the surface of the cooled electronic device at a temperature higher than the environmental dew point. The heater assembly includes thin film heaters 6 attached to the 1st heat insulating layer 5 in order to keep the surface at a temperature higher than the environmental dew point, and wire mesh heaters 7 hung in the internal space in order to lower a relative humidity in the internal space and avoid the penetration of steam.