公开(公告)号：JPH1092977A

公开(公告)日：1998-04-10

申请号：JP21839897

申请日：1997-08-13

Applicant: IBM

Inventor： ANASTASIOS PETEL ANGEROPUUROSU ,  GERALD WALTER JONES ,  RICHARD WILLIAM MAREKU ,  HAIKE MARUTSUERO ,  JEFFREY MATSUKEBUINII

IPC: C08L63/04 ,  H01L23/14 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To manufacture an electronic package having an organic board. SOLUTION: An electronic package board is made of glass fibers and epoxy resin. In order to form a circuit on the electronic package board by an additive method, organic polymer electrolyte is applied to the surface of the organic board. A colloidal palladium-tin seed layer is deposited on the surface of the organic polymer electrolyte. Successively, optically focusable polymer is applied to the surface of the seed layer. The optically focusable polymer layer is patterned by photolithography to expose a part of the seed layer. The exposed part of the seed layer functions as catalyst of nonelectrolytic copper plating. Thus, a copper conductor layer is applied to the exposed part of the seed layer. In accordance with the ionization characteristics of employed individual polymer electrolytes, the organic polymer electrolyte is deposited from a solution whose pH is suitable for the required seed catalyst covering.