CONTROL OF CONTAMINANT IN ELECTROLESS PLATING BATH

    公开(公告)号:JPS6320485A

    公开(公告)日:1988-01-28

    申请号:JP9216287

    申请日:1987-04-16

    Applicant: IBM

    Abstract: An electroless plating bath (11) is selectively cleaned of organic contaminants. The organic contaminants are detected by measuring the capacitance between a working electrode (26) and counter electrode (27) with a potentiostat (31). The capacitance measurements are used to indicate the level of organic contaminants. Exposure of the dummy plating surface (39) in the electroless plating bath is controlled such that the exposed surface is directly proportional to the detected level of organic contaminants.

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