公开(公告)号：GB2502216B

公开(公告)日：2019-11-27

申请号：GB201314185

申请日：2012-01-04

Applicant: IBM

Inventor： DYLAN JOSEPH BODAY ,  JOSEPH KUCZYNSKI ,  ROBERT MEYER III

IPC: H01L23/373 ,  C09K5/14 ,  H01L23/42 ,  H05K7/20

Abstract: The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×1011 ohm-cm or more.