公开(公告)号：DE69301812T2

公开(公告)日：1996-09-26

申请号：DE69301812

申请日：1993-11-22

Applicant: IBM

Inventor： RUANE ROBERT EMMETT ,  WHITE JR

IPC: H01R3/00 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K3/40

Abstract: A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines (5,6) contained within each substrate to melt and form a fused mass (9) protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.

公开(公告)号：DE69301812D1

公开(公告)日：1996-04-18

申请号：DE69301812

申请日：1993-11-22

Applicant: IBM

Inventor： RUANE ROBERT EMMETT ,  WHITE JR

IPC: H01R3/00 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K3/40

Abstract: A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines (5,6) contained within each substrate to melt and form a fused mass (9) protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.