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公开(公告)号：DE69301812D1
公开(公告)日：1996-04-18
申请号：DE69301812
申请日：1993-11-22
Applicant: IBM
Inventor： RUANE ROBERT EMMETT , WHITE JR
Abstract: A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines (5,6) contained within each substrate to melt and form a fused mass (9) protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.
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公开(公告)号：DE69301812T2
公开(公告)日：1996-09-26
申请号：DE69301812
申请日：1993-11-22
Applicant: IBM
Inventor： RUANE ROBERT EMMETT , WHITE JR
Abstract: A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines (5,6) contained within each substrate to melt and form a fused mass (9) protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.
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公开(公告)号：DE3575952D1
公开(公告)日：1990-03-15
申请号：DE3575952
申请日：1985-02-22
Applicant: IBM
Inventor： BLACKWELL KIM JOSEPH , WHITE JR , WILSON JAMES WARREN
IPC: C23C14/34 , C23C14/04 , C23C14/22 , C23C14/35 , H01J37/34 , H01L21/203 , H01L21/285 , H05K3/40 , C23C14/24 , H05K3/18
Abstract: A system for vacuum depositing a material onto a sample (12) having a surface recess, such as a hole or channel, therein. The system includes a vacuum chamber capable of attaining a high vacuum and a vacuum deposition source (134) in the chamber for emitting atoms. An energy source (130) is connected to the vacuum deposition source (134) to initiate emission of the atoms therefrom. A sample (12) having an upper surface disposed in the vacuum chamber opposite the vacuum deposition source (134) is adapted to receive the atoms emitted from the vacuum deposition source (134). The ' sample (12) has surface recesses (14-20) therein with walls (22) substantially perpendicular to the plane of the sample (12). Finally, a component (146, 148) for eliminating undesirable depositing angles of atoms is disposed intermediate the vacuum deposition source (134) and the sample (12) in order t to improve the ratio of recess wall to sample surface deposition. Another important feature of the component for eliminating undesirable depositing angles is its ability to reduce heat generated on the sample (12) during the deposition process.
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