公开(公告)号：DE2537444A1

公开(公告)日：1976-03-25

申请号：DE2537444

申请日：1975-08-22

Applicant: IBM

Inventor： HAINING FRANK WALTON ,  RUBINO ROBERT VENANZIO ,  WILEY ROBERT TAYLOR

IPC: H05K3/00 ,  H01B5/14

Abstract: The method of printed circuit production consists of following steps. The laminated board is placed in an atmosphere whose temperature and relative humidity is accurately controlled, so that the laminated board expands in length and width. It is heated at an accurately controlled temperature. It is again placed in an atmosphere whose temperature and relative humidity are accurately controlled. It is then reheated at a strictly controlled temperature, and then recooled. The controlled atmosphere is in the temperature region of 15.6 to 37.8 deg.C and in a relatively dry air atmosphere between 20% and 100%. The treatment cycles are for 10 to 30 minutes.