公开(公告)号：DE2315402A1

公开(公告)日：1973-10-04

申请号：DE2315402D

申请日：1973-03-28

Applicant: IBM

Inventor： RYAN SEN WILLIAM JOHN ,  SCHIRMER EDWARD FRANCIS ,  THOMA NANDOR GYORGY ,  TOLLEY JAMES HOBERT ,  WILDER DONALD LAWRENCE

IPC: H01L21/00 ,  H01L21/683 ,  H01L7/64

Abstract: A system for handling an oriented array of objects, such as integrated circuit chips, includes a fixture in which the chips are held in place by vacuum means. A chip placement tube is capable of reciprocal motion normal to the plane of the fixture to move a chip unidirectionally from its position in the array for placement on a substrate. The system further includes means for positioning a substrate precisely with respect to a chip in the array to allow its direct placement from the array. This fixture and system allows the precise orientation and alignment of semiconductor chips in a wafer to be maintained for laser dicing and chip positioning on a substrate without requiring reorientation. When combined with testing and inspection apparatus and a suitable memory, the system further allows handling and processing of chips to be minimized.