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公开(公告)号：DE3377959D1
公开(公告)日：1988-10-13
申请号：DE3377959
申请日：1983-10-21
Applicant: IBM
Inventor： JOHNSON CHARLES LUTHER , RYBA JOHN MICHAEL
IPC: H01L23/52 , H01L21/60 , H01L23/498 , H01L23/48
Abstract: An IC chip connected to a substrate (10) by a pattern of pads (12) arranged in single lines along the radial edges of segments (15) of a polygon underlying the chip-linear conductors from the pads cross the outer edge of the segments in parallel groups. Wider power conductors (232, 233) can also be placed in the pattern.
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