Simultaneous double diffusion into a semiconductor substrate
    1.
    发明授权
    Simultaneous double diffusion into a semiconductor substrate 失效
    同时双向扩散成半导体基板

    公开(公告)号:US3748198A

    公开(公告)日:1973-07-24

    申请号:US3748198D

    申请日:1970-01-22

    Applicant: IBM

    Inventor: BASI J SANDHU J

    Abstract: A SIMULTANEOUS DOUBLE DIFFUSION METHOD WHEREIN A COATING CONTAINING A SILICON OXIDE AND THE OXIDES OF A PLURALITY OF CONDUCTIVITY-DETERMINING IMPURITIES HAVING DIFFERENT DIFFUSIVITY RATES IS FORMED ON THE SURFACE OF A SEMICONDUCTOR SUBSTRATE USING A TEMPERATURE AT WHICH SUBSTANTIALLY NO DIFFUSION OF THE IMPURITIES INTO THE SUBSTRATE WILL TAKE PLACE. THEN, THE SUBSTRATE IS HEATED TO SIMULTANEOUSLY DIFFUSE THE IMPURITIES INTO THE SUBSTRATE TO FORM A PLURALITY OF ABUTTING REGIONS IN THE SUBSTRATE SEPARATED BY JUNCTIONS. THE SEQUENCE OF REGIONS IN DISTANCE, WITH RESPECT TO THE SUBSTRATE SURFACE, IS CONTROLLED BY THE DIFFUSIVITY RATES OF THE SELECTED CONDUCTIVITY-DETERMINING IMPURITIES. THE COATING MAY BE A SINGLE LAYER OR A PLURALITY OF LAYERS, AT LEAST TWO OF WHICH CONTAIN DIFFERENT CONDUCTIVITY-DETERMINING IMPURITIES.
    D R A W I N G

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