公开(公告)号：DE2548329A1

公开(公告)日：1976-07-01

申请号：DE2548329

申请日：1975-10-29

Applicant: IBM

Inventor： SANTILLO JUN GEORGE R

IPC: B26F3/00 ,  B28D5/00 ,  B28D5/02 ,  B28D5/04 ,  C04B41/53 ,  C23F1/02 ,  C30B33/00 ,  H01L21/304 ,  B28D1/22

Abstract: Disclosed is a method and apparatus for thermochemically slicing wafers from a crystal boule by propelling a continuous flow of an acid etching solution against a heated wire which is adjacent the intended line of etch while providing for relative movement between the boule and the chemical etching solution to thereby effect a slicing action of the boule.

公开(公告)号：DE2522611A1

公开(公告)日：1976-01-15

申请号：DE2522611

申请日：1975-05-22

Applicant: IBM

Inventor： PANTUSCO ANTHONY A ,  PINCKNEY WARREN J ,  SANTILLO JUN GEORGE R ,  SCHARFF GERARD J

IPC: C30B15/30 ,  H01L21/208 ,  B01J17/18