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公开(公告)号:DE2816328A1
公开(公告)日:1978-10-19
申请号:DE2816328
申请日:1978-04-14
Applicant: IBM
IPC: C25D5/16 , H01R4/26 , H01R4/58 , H01R13/22 , H01R13/28 , H05K1/11 , H05K3/32 , H05K3/36 , H05K3/40 , H01H1/06 , H01L23/50
Abstract: An electrical contact device consists of a substrate having a dendritic array which is grown on it and the dendrites are adapted to releasably engage corresponding dendrites on a mating surface. A typical contact comprises a conducting base plate (11) bearing a group of elastic metallic projections (13). For this purpose a suitable base plate consists of a substrate with a coating of noble metal (15) on which the dendrite crystals are formed. A second electrical contact is similarly formed of a conducting base plate (21) with closely spaced, elastic metallic projections (23). On being brought together the dendritic crystals interlock to form a good electrical connection which can, however, be readily separated. The technique is suitable for connections to LSI integrated circuits.