公开(公告)号：US3729206A

公开(公告)日：1973-04-24

申请号：US3729206D

申请日：1971-10-21

Applicant: IBM

Inventor： CACHON R ,  PERLMANN A ,  SCHORR M

IPC: B25B11/00 ,  H01L21/683 ,  H01L7/00

CPC classification number: B25B11/005 ,  Y10T279/11

Abstract: Automatically operated vacuum chuck apparatus employs fluidic logic selectively to retain semiconductor wafers or parts of broken wafers during processing. The chuck has vacuum connectors communicating with ports in a retaining surface that holds the wafer or part of the wafer. Individual fluidic logic circuits are connected in parallel to respective ones of these connectors and ports and in common to vacuum and pressure supplies. On apparatus actuation, those ports covered by the wafer or part thereof are sensed and vacuum is applied only to these ports under the control of the individual fluidic logic circuits.

Abstract translation: 自动操作的真空吸盘装置在处理过程中选择性地使用流体逻辑来保持半导体晶片或破碎晶片的部分。 卡盘具有与保持晶片或晶片的一部分的保持表面中的端口连通的真空连接器。 单独的流体逻辑电路与这些连接器和端口中的相应的一个并联连接，并且与真空和压力源相同。 在设备致动时，感测由晶片或其一部分覆盖的那些端口，并且在单独的流体逻辑电路的控制下仅向这些端口施加真空。