公开(公告)号：JP2004071920A

公开(公告)日：2004-03-04

申请号：JP2002230794

申请日：2002-08-08

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： SEIHIKARI YOSHINORI ,  MOROOKA MITSUO ,  YOSHIMURA YUSUKE ,  HIROMORI TADASHI

IPC: G02F1/1368 ,  C23F1/44 ,  G09F9/30 ,  G09F9/35 ,  H01L21/28 ,  H01L21/306 ,  H01L21/3205 ,  H01L23/52 ,  H01L27/32 ,  H01L29/786 ,  H01L51/50 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide an etchant which enables formation of a taper-shaped conductive wiring with ease and high precision.
SOLUTION: An etching solution is provided to carry out etching against a conductive film consisting of a first layer, which consists of metal to be passivated, and a second layer provided on the first layer. The etchant comprises nitric acid, hydrofluoric acid and a compound which is an acetate ion source, and passivates the first layer.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2000321580A

公开(公告)日：2000-11-24

申请号：JP12292399

申请日：1999-04-28

Applicant: IBM

Inventor： KOSEKI TOSHIHIKO ,  YAMASHITA HIDEFUMI ,  HASUMI TARO ,  MOMOI YUICHI ,  SEIHIKARI YOSHINORI ,  SHIROUCHI TOMOHITO

IPC: G02F1/1333 ,  G02F1/1339

Abstract: PROBLEM TO BE SOLVED: To form a spherical spacer at a specified position, to suppress production of foams at a low temperature and to obtain a liquid crystal display device equipped with the spacer having resistance to local load, by controlling the hardness (DH) of the spacer consisting of a photosensitive resin for regulating the cell gap between substrates to a specified range. SOLUTION: The device comprises an array substrate 12 and a color filter substrate 14 disposed facing each other, a spacer 18 consisting of a photosensitive resin to regulate the cell gap 16 between the substrates, and a liquid crystal 20. As for the spacer 18, a photosensitive resin satisfying the conditions that the hardness (DH) obtained by the formula of DH=K×Pmax/hmax2 ranges 26 to 30 is used. In the formula, DH is the hardness (kgf/mm2), Pmax is the maximum load (kgf), hmax is the maximum displacement (mm) as the sum of the elastic deformation and plastic deformation, and K is a constant intrinsic to the device obtd. from the displacement of the indenter.