公开(公告)号：JPH1174444A

公开(公告)日：1999-03-16

申请号：JP17826198

申请日：1998-06-25

Applicant: IBM

Inventor： JAMES H KOVEL II ,  SHAJII FARUUKU ,  PETER ALFRED GRUBER ,  SUDIPUTA KUMAR RAI

IPC: B22C9/22 ,  B23K3/06 ,  B23K35/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form solder column on a substrate by removing a mold leaving solder mounds on the surface of the substrate after bonding the solder columns on the substrate and cooling the mold. SOLUTION: This component is provided with a chip 11 electrically connected to a substrate 13 by C4 bumps 12. The bumps 12 are encircled with a capsule sealer 17 normally made of epoxy material. A cooling surface chip 18 is entirely encapsulated on the substrate 13 with a cap 19. The substrate 13 normally to be a multiceramic package is provided with bottom side metallurgy(BSM) pads 14. A mold 16 containing solder columns 15 therein is displayed in partly removed state from the bottomside of the substrate 13 and the pads 14. In such a constitution, the mold 16 is separated from the electronic component 10 leaving the columns 15 electricallyt and firmly connected to the substrate 13 and the BSM pads 14 intact after reflowing and succeeding cooling steps.