公开(公告)号：JPH11111764A

公开(公告)日：1999-04-23

申请号：JP22771398

申请日：1998-08-12

Applicant: IBM

Inventor： PETER J BROFMAN ,  PATRICK A KOIKO ,  MARK G COURTNEY ,  JAMES H KOVEL II ,  JERZY FALUKE ,  LEWIS S GOLDMAN ,  RAYMOND A JACKSON ,  DAVID C LINNELL ,  GREGORY B MARTIN ,  FRANK L PONPEO ,  KATHLEEN A SUTATSURAA ,  HILTON T TOY

IPC: B23K35/02 ,  H01L21/60 ,  H01L23/48 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form an extended solder bond between two substrates which are mutually connected by solder to form an electronic module, by reflowing an extensible paste solder bump to extend an extension means thereof so as to raise the height of a first mutual solder connection, and forming an extended solder bond in the electronic module. SOLUTION: The distance between the upper surface of a substrate 19 and the lower surface of a substrate 16 which faces the substrate 19, is represented by C. A paste 17, which is formed on the substrate 19, is in receipt of the lower end of a reflowed solder ball 18 so as to be in contact therewith. The height of an extensible solder bump 14 is represented by B which is smaller than the height C of the solder ball 18. When the solder ball 18 is heated at a temperature high enough only to reflow itself, the substrate 16 lowers toward the substrate 19 as the solder ball 18 melts. Since the reflow temperature of the solder ball 18 is lower than that of the extensible solder bump 14, the bump 14 remains solid during the heating so as to contribute to preventing the substrate 16 from going down to the level lower than the height B.

公开(公告)号：JPH1174444A

公开(公告)日：1999-03-16

申请号：JP17826198

申请日：1998-06-25

Applicant: IBM

Inventor： JAMES H KOVEL II ,  SHAJII FARUUKU ,  PETER ALFRED GRUBER ,  SUDIPUTA KUMAR RAI

IPC: B22C9/22 ,  B23K3/06 ,  B23K35/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To form solder column on a substrate by removing a mold leaving solder mounds on the surface of the substrate after bonding the solder columns on the substrate and cooling the mold. SOLUTION: This component is provided with a chip 11 electrically connected to a substrate 13 by C4 bumps 12. The bumps 12 are encircled with a capsule sealer 17 normally made of epoxy material. A cooling surface chip 18 is entirely encapsulated on the substrate 13 with a cap 19. The substrate 13 normally to be a multiceramic package is provided with bottom side metallurgy(BSM) pads 14. A mold 16 containing solder columns 15 therein is displayed in partly removed state from the bottomside of the substrate 13 and the pads 14. In such a constitution, the mold 16 is separated from the electronic component 10 leaving the columns 15 electricallyt and firmly connected to the substrate 13 and the BSM pads 14 intact after reflowing and succeeding cooling steps.