公开(公告)号：JP2005055885A

公开(公告)日：2005-03-03

申请号：JP2004213302

申请日：2004-07-21

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： ALAN F BENER ,  EVAN G COLGAN ,  LIN HOW TZU ,  MAGERLEIN JOHN H ,  FRANK L PONPEO ,  SHINDE SUBHASH L ,  STIGLIANI DANIEL J JR

IPC: G02B6/36 ,  G02B6/42 ,  G06F1/20 ,  G06F3/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4268 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292

Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic assembly for a computer system with respect to a mounting structure to establish optoelectronic communication between an electronic chip on a first level package and a high-density light transmitter-receiver. SOLUTION: The optoelectronic assembly includes an electronic chip 110, a substrate 120, an electric signaling medium 140, an optoelectronic transducer 160, and an optical coupling guide 170. The electronic chip is in communication with the substrate, which is in communication with a first end of the electric signaling medium. A second end of the electric signaling medium is in communication with the optoelectronic transducer. The optical coupling guide positions an optical signaling medium with respect to the optoelectronic transducer. An electric signal from the electronic chip is transmitted to the optoelectronic transducer via the substrate and the electric signaling medium. The electronic chip and the optoelectronic transducer share a common heat spreader. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为相对于安装结构提供用于计算机系统的光电组件，以建立第一级封装上的电子芯片与高密度光收发器之间的光电连通。 解决方案：光电组件包括电子芯片110，基板120，电信号介质140，光电转换器160和光耦合引导件170.电子芯片与正在通信的基板连通 具有电信号介质的第一端。 电信号介质的第二端与光电转换器连通。 光耦合引导件相对于光电传感器定位光信号介质。 来自电子芯片的电信号通过基板和电信号介质传输到光电换能器。 电子芯片和光电传感器共享共用散热器。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JPH0925167A

公开(公告)日：1997-01-28

申请号：JP33144795

申请日：1995-12-20

Applicant: IBM ,  CARBORUNDUM CO

Inventor： CASEY JON A ,  CORDERO CARLA N ,  FASANO BENJAMIN V ,  GOLAND DAVID B ,  HANNON ROBERT ,  HARRIS JONATHAN H ,  HERRON LESTER W ,  JOHNSON GREGORY M ,  PATEL NIRANJAN M ,  REITTER ANDREW M ,  SHINDE SUBHASH L ,  VALLABHANENI RAO V ,  YOUNGMAN ROBERT A

IPC: B32B18/00 ,  B22F7/02 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

公开(公告)号：ES2253697T3

公开(公告)日：2006-06-01

申请号：ES03750726

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: Una estructura de montaje óptico para la conexión de una serie de áreas bidimensionales de matrices de VCSEL a un cuadro, que comprende: una matriz de VCSEL (10) que contiene dicha serie de áreas de VCSEL (15-i), estado rodeada dicha serie de áreas por una costura de adhesión metalizada (12) sobre una superficie superior de la misma; una unidad de transferencia óptica de precisión (20) que contiene una costura de adhesión (22) correspondiente sobre su parte inferior que corresponde a dicha costura de adhesión metalizada (12) sobre dicha matriz de VCSEL (10), estando dispuesta dicha costura (22) correspondiente sobre la parte inferior de un reborde (23), de manera que la alineación entre dicha matriz (10) y dicha unidad de transferencia óptica (20) es proporcionada por el reborde (23) que está adaptado para formar un borde vertical (13) de un escalón que es decapado en la parte superior de la matriz (10); y una primera serie de salientes (24) sobre una superficie superior de dicha unidad detransferencia óptica (20); conteniendo dicha unidad de transferencia óptica (20) medios de transferencia óptica (25-i) para transferir radiación emitida desde dicha serie de áreas de VCSEL (15- i), por lo que la limitación de la tolerancia para dichos medios de transferencia óptica (25-i) es 10 m, y la limitación de la tolerancia para la distancia vertical entre dichos medios de transferencia óptica (25-i) y dicha matriz de VCSEL (10) es 50 m; y un conector óptico (30) enchufable que tiene una unidad de transmisión óptica (35) insertada en una cavidad del mismo, una serie de receptáculos de interbloqueo (34) sobre una superficie inferior del mismo que coincide con dicha primera serie de salientes (24) sobre dicha superficie superior de dicha unidad de transferencia óptica (20) y una segunda serie de salientes (36) sobre una superficie superior de dicho conector óptico (30) enchufable para coincidencia con dicho cuadro.

公开(公告)号：SG34299A1

公开(公告)日：1996-12-06

申请号：SG1995001804

申请日：1995-11-10

Applicant: IBM ,  CARBORUNDUM CO

Inventor： CASEY JON A ,  CORDERO CARLA N ,  FASANO BENJAMIN V ,  GOLAND DAVID B ,  HANNON ROBERT ,  HARRIS JONATHAN H ,  HERRON LESTER W ,  JOHNSON GREGORY M ,  PATEL NIRANJAN M ,  REITTER ANDREW M ,  SHINDE SUBHASH L ,  VALLABHANENI RAO V ,  YOUNGMAN ROBERT A

IPC: B22F7/02 ,  B32B18/00 ,  C04B35/581 ,  C04B37/02 ,  C04B41/51 ,  C04B41/52 ,  C04B41/88 ,  C04B41/89 ,  C22C29/16 ,  H01L21/48 ,  H01L23/373 ,  H05K1/03 ,  H05K3/24 ,  H05K3/40 ,  H05K3/46

Abstract: Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

公开(公告)号：DE60303140D1

公开(公告)日：2006-03-30

申请号：DE60303140

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

公开(公告)号：AU2003268949A1

公开(公告)日：2004-04-19

申请号：AU2003268949

申请日：2003-08-28

Applicant: IBM

Inventor： LUIJTEN RONALD P ,  SHINDE SUBHASH L ,  KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

公开(公告)号：DE60303140T2

公开(公告)日：2006-08-31

申请号：DE60303140

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.

公开(公告)号：AT315240T

公开(公告)日：2006-02-15

申请号：AT03750726

申请日：2003-08-28

Applicant: IBM

Inventor： KNICKERBOCKER JOHN U ,  JACOBOWITZ LAWRENCE ,  LUIJTEN RONALD P ,  SHINDE SUBHASH L

IPC: G02B6/42 ,  G02B6/43

Abstract: A set of interlocking modules supports and connects a die containing lasers, a set of precision molded lenses and a set of beam switching elements. Another embodiment of the invention is a structure for mounting a logic chip and an optical chip on a chip carrier, with the optical chip being mounted on the side of the carrier facing the system board on which the carrier is mounted, so that radiation travels in a straight path from optical sources on the optical chip into optical transmission guides on the board.