公开(公告)号：JP2001044158A

公开(公告)日：2001-02-16

申请号：JP2000179330

申请日：2000-06-15

Applicant: IBM

Inventor： LI LEPING ,  SHINUI WAN

IPC: H01L21/302 ,  B24B37/013 ,  B24B49/16 ,  H01L21/304 ,  B24B37/04

Abstract: PROBLEM TO BE SOLVED: To provide a method and apparatus for detecting the end point of a film removal process for removing a film by a polishing apparatus having a polishing surface coupled to a shaft. SOLUTION: Distortion of a shaft 15 caused by a torque generated by the friction of a polishing surface is detected. The detection is attached by monitoring phase difference between optical signals reflected from two points on the shaft with the use of a sensor 201 mounted on the shaft. Following the shaft deformation, signals are generated. Changes in the signals indicates a change in the torque, thereby indicating the end point of the film removal process. With this arrangement, real-time original position monitoring and control of the process can be realized.