公开(公告)号：JPH05182518A

公开(公告)日：1993-07-23

申请号：JP13440092

申请日：1992-04-28

Applicant: IBM

Inventor： SHIYAAMA PURASADO MUKEERUJIEE ,  DEIBITSUDO UEI WAN

IPC: H01B3/00 ,  H01B3/30 ,  H05K1/03

Abstract: PURPOSE: To provide low dielectric constant aerogel minute granular matter- containing composite resin which is applied to a board surface such as a ceramic or multilayer ceramic board and can be photolithographically processed when the resin is photosensitive polymer. CONSTITUTION: Low cost material which contains aerogel minute spherical bodies uniformly distributed so as to have molecular, dimension (nano-scale) gaps, and has a low dielectric constant, and of which a thermal expansion rate is controlled is manufactured by extruding, standard impregnating, and laminating technology. Aerosol minute spherical bodies are manufactured by sol-gel technology and supercritical drying of sol-gel particulates. By using lamination containing the material, through holes can be finely made so that the same can be used as a board for a surface mounting device.