公开(公告)号：JPH05239180A

公开(公告)日：1993-09-17

申请号：JP17509492

申请日：1992-07-02

Applicant: IBM

Inventor： FUREDERITSUKU RICHIYAADO KURIS ,  KOSUTASU PAPATOMASU ,  DEIBITSUDO UEI WAN

IPC: C08G18/76 ,  C08G73/06 ,  C08L79/04 ,  C09J175/00 ,  C09J175/04 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29

公开(公告)号：JPH05197147A

公开(公告)日：1993-08-06

申请号：JP16475691

申请日：1991-07-05

Applicant: IBM

Inventor： BOYA RISUTA MARUKOBITSUKU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO ,  DEIBITSUDO UEI WAN

IPC: G03F7/004 ,  G03F7/023 ,  G03F7/029 ,  G03F7/038 ,  G03F7/30 ,  H01L21/027 ,  H01L21/30 ,  H05K3/06 ,  H05K3/28 ,  H05K3/34

Abstract: PURPOSE: To lower a heat expansion coefficient and to enhance resistance to high temperature and photopatternability characteristics and the like by using the composition comprising a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. CONSTITUTION: The photopatternable composition comprises the cationically polymerizable epoxy resin, the solvent material and the photosensitive cationic photoiniciator mixed with the optically transparent ceramic filler and it is thermally stable at 360 deg.C. This composition is polymerized by exposure to ultraviolet rays. The unexposed areas of the composition are not polymerized by selectively shielding the composition from ultraviolet rays with a pattern or stencil, and these nonpolymerized areas are dissolved in a proper solvent and removed, and the remaining developed areas are hardened to a sufficient cross-linking degree and made resistant enough to exposure at 360 deg.C and to be made a tough protective coat having a heat expansion coefficient similar to solder.

公开(公告)号：JPH05163467A

公开(公告)日：1993-06-29

申请号：JP28959691

申请日：1991-11-06

Applicant: IBM

Inventor： CHIYAARUZU ROBAATO DEIBISU ,  ASHITO AABINDO MEETA ,  KONSUTANTEINOSU PAPATOMASU ,  RII POORU SUPURINGAA ,  UIRIAMU JIYOZEFU SUMA ,  DEIBITSUDO UEI WAN

IPC: C09J7/02 ,  C09J163/00 ,  C09J163/02 ,  C09J179/00 ,  C09J179/04 ,  H01L23/12 ,  H01L23/14 ,  H05K3/38 ,  H05K3/46

公开(公告)号：JPH0358050A

公开(公告)日：1991-03-13

申请号：JP16007690

申请日：1990-06-20

Applicant: IBM

Inventor： JIEFURII DONARUDO JIEROOMU ,  YUUJIIN ROOMAN SUKARUBINKO ,  DEIBITSUDO UEI WAN

IPC: C08G73/06 ,  C08G73/12 ,  G03F7/004 ,  G03F7/029 ,  G03F7/038 ,  G03F7/039 ,  H01L21/027

Abstract: PURPOSE: To enhance the resolving power and various mechanical characteristics of a coating film and to form a permanent mask by incorporating a specified curable compd. and a specified photoinitiator into a compsn. CONSTITUTION: This compsn. contains curable cyanate ester or its prepolymer (A) and a cationic photoinitiator (B). A compd. represented by formula I or its prepolymer is preferably used as the component A. Onium salt of a group VIa or VII element is preferably used as the component B when this compsn. is a positive type compsn. and an iron arene compd. represented by formula II is preferably used as the component B when this compsn. is a negative type compsn. In the formula I, A is a single bond, S, etc., R is H, 1-8C alkyl, etc., and (n) is 0-4. In the formula II, L is aryl and X is a non-nucleophilic anion.

公开(公告)号：JPH0661303A

公开(公告)日：1994-03-04

申请号：JP4082191

申请日：1991-02-14

Applicant: IBM

Inventor： FUREDERITSUKU RICHIYAADO KURIS ,  KOSUTASU AI PAPATOMASU ,  DEIBITSUDO UEI WAN

IPC: H01L21/52 ,  H01L21/56 ,  H01L21/60 ,  H01L23/29 ,  H05K3/28 ,  H05K3/34

Abstract: PURPOSE: To form a mutual solder bond connection showing an improved fatigue life and stability by hardening a compsn. of an alicyclic epoxide or hardening cyanate ester or its prepolymer with a binder. CONSTITUTION: A binder has a viscosity of about 1000 centipoises or less at the room temp. A filler has a max. grain size of 31 microns and substantially no α-particle radiation. The binder content (of an epoxy and/or cyanate ester) is about 60-25 wt.% of the sum of the binder and filler. This compsn. is filled in a gap between a chip carrier 2 and semiconductor chip 1 soldered thereto through solder bumps 3 and hardened. As the result, a substantially gapless seal with sounder bonds is realized to ensure a highly reliable device and increase the fatigue life of the mutual solder bond.

公开(公告)号：JPH05182518A

公开(公告)日：1993-07-23

申请号：JP13440092

申请日：1992-04-28

Applicant: IBM

Inventor： SHIYAAMA PURASADO MUKEERUJIEE ,  DEIBITSUDO UEI WAN

IPC: H01B3/00 ,  H01B3/30 ,  H05K1/03

Abstract: PURPOSE: To provide low dielectric constant aerogel minute granular matter- containing composite resin which is applied to a board surface such as a ceramic or multilayer ceramic board and can be photolithographically processed when the resin is photosensitive polymer. CONSTITUTION: Low cost material which contains aerogel minute spherical bodies uniformly distributed so as to have molecular, dimension (nano-scale) gaps, and has a low dielectric constant, and of which a thermal expansion rate is controlled is manufactured by extruding, standard impregnating, and laminating technology. Aerosol minute spherical bodies are manufactured by sol-gel technology and supercritical drying of sol-gel particulates. By using lamination containing the material, through holes can be finely made so that the same can be used as a board for a surface mounting device.