公开(公告)号：JP2001353656A

公开(公告)日：2001-12-25

申请号：JP2001127185

申请日：2001-04-25

Applicant: IBM

Inventor： CHEN SHYNG-TSONG ,  MICHAEL F ROFARO ,  SMITH WOODY RAY

IPC: B24B37/22 ,  B24B37/24 ,  B24B49/08 ,  B24D13/20 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a stacked type wafer polishing pad capable of changing its hardness. SOLUTION: A polishing pad assembly to be used in a chemical machinery polishing device having a polishing platen is provided. This polishing pad assembly includes a first pad disposed on the platen. The first pad is provided with a sealable enclosure having a flexible skin in which porous material is partially filled. A control mechanism is adapted to inject fluid into the enclosure, and extract fluid from the enclosure. Hardness of the first pad is changed in accordance with quantity of fluid in the enclosure. A second pad is disposed on the first pad.